Simplified mechanical package for EL displays

• US 5,661,364 A
• Filed: 12/11/1995
• Issued: 08/26/1997
• Est. Priority Date: 12/11/1995
• Status: Expired due to Term

• Current Assignee: Beneq Oy (Qingdao Sifang SRI & Intellectual Co., Ltd.)
• Original Assignee: Planar Systems Incorporated (Leyard Optoelectronic Co., Ltd.)
• Inventors: Kruskopf, Mark
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US08/570,590
• Time in Patent Office: 624 Days
• Field of Search: 445/24, 445/23, 313/512, 313/506
• US Class Current: 313/512
• CPC Class Codes: H05B 33/02 Details

Abstract

A construction for an electroluminescent display device comprises an electroluminescent element stack having an outer edge and including a light emitting electroluminescent panel, an electronic circuit board, and a connector electrically coupling the electronic circuit board to the electroluminescent panel. A frame member of generally U-shaped cross-section fits over and compresses the electroluminescent element stack along the outer edge. Additionally, a method of constructing an electroluminescent display device comprises the steps of forming an electroluminescent element stack having a light emitting panel, an electronic circuit board and a connector coupling the electronic circuit board to the electroluminescent panel. The electroluminescent element stack is formed to have an outer edge. A frame member is formed to have generally U-shaped cross-section and resilient arms. The frame member is fitted onto the outer edge of the electroluminescent element stack so as to compress the electroluminescent element stack together. The frame member may be formed by extrusion. The connector may be an elastomeric connector.

Claims

1. A construction for an electroluminescent display device comprising:

(a) an electroluminescent element stack having an outer edge and including a light emitting electroluminescent panel, an electronic circuit board and a connector electrically coupling the electronic circuit board to the electroluminescent panel; and

(b) a frame member of generally U-shaped cross section, said frame member having resilient arms fitting over and compressing the electroluminescent element stack along said outer edge thereof.

2. A construction for an electroluminescent display device according to claim 1, wherein the electroluminescent element stack includes a back plate adjacent to the light emitting electroluminescent panel.

3. A construction for an electroluminescent device according to claim 2 wherein the backplate has a side, the side being adjacent to the connector so as to support the connector.

4. A construction for an electroluminescent display device according to claim 1 wherein the resilient arms are convex flared resilient arms.

5. A construction for an electroluminescent display device according to claim 1 wherein the electronic circuit board has a bottom margin and one or more protrusions along said bottom margin, and one of said resilient arms has a lip fitting over said protrusions so that the frame is securely coupled to the stack.

6. A method of constructing an electroluminescent display device comprising the steps of:

(a) forming an electroluminescent element stack comprising a light emitting panel, an electronic circuit board and a connector coupling the circuit board to the electroluminescent panel, said stack formed to have an outer edge;

(b) forming a frame member of generally U-shaped cross section and providing said frame member with resilient arms; and

(c) fitting said frame member onto said outer edge of said electroluminescent element stack so as to press said stack together.

7. The method of claim 6 wherein the electroluminescent element stack includes a back plate adjacent to the light emitting electroluminescent panel.

8. The method of claim 7 wherein the backplate is formed to have a side, and said connector is positioned adjacent to said side.

9. The method of claim 6 wherein the frame member is formed by extrusion.

10. The method of claim 6 wherein the connector is an elastomeric connector.

11. The method of claim 6 wherein the resilient arms are formed to be convex flared resilient arms.

12. The method of claim 6 wherein the electronic circuit board is formed to have a bottom margin and one or more protrusions along said bottom margin, and one of the resilient arms is formed to have a lip, and the frame is fitted over the outer edge by fitting the lip over the protrusions and rotating the frame about an axis parallel to the outer edge so that the frame is securely coupled to the stack.

13. The method of claim 12 wherein the protrusions are formed from solder.