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Low temperature glass paste with high metal to glass ratio

  • US 5,663,109 A
  • Filed: 05/29/1996
  • Issued: 09/02/1997
  • Est. Priority Date: 10/19/1992
  • Status: Expired due to Fees
First Claim
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1. An essentially resin free paste consisting essentially of by weight:

  • from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt;

    from about 2% to about 24% of a glass composition which consists essentially of, by weight on an oxide basisabout 40-65% Ag2 Oabout 15-35% V2 O5about 0-20% TeO2 andabout 0-30% of at least one of a group consisting of PbO2 and Pb3 O4,wherein said conductive metallic particles and said glass composition have a ratio by weight of no more than about 32;

    1;

    about 8-15% of an organic solvent; and

    a resin percentage of less than 0.1% of said paste.

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