Low temperature glass paste with high metal to glass ratio
First Claim
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1. An essentially resin free paste consisting essentially of by weight:
- from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt;
from about 2% to about 24% of a glass composition which consists essentially of, by weight on an oxide basisabout 40-65% Ag2 Oabout 15-35% V2 O5about 0-20% TeO2 andabout 0-30% of at least one of a group consisting of PbO2 and Pb3 O4,wherein said conductive metallic particles and said glass composition have a ratio by weight of no more than about 32;
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about 8-15% of an organic solvent; and
a resin percentage of less than 0.1% of said paste.
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Abstract
A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis:
about 40-65% Ag2 O
about 15-35% V2 O5
about 0-30% PbO2
about 0-20% TeO2
The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.
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Citations
18 Claims
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1. An essentially resin free paste consisting essentially of by weight:
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from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt; from about 2% to about 24% of a glass composition which consists essentially of, by weight on an oxide basis about 40-65% Ag2 O about 15-35% V2 O5 about 0-20% TeO2 and about 0-30% of at least one of a group consisting of PbO2 and Pb3 O4, wherein said conductive metallic particles and said glass composition have a ratio by weight of no more than about 32;
1;about 8-15% of an organic solvent; and a resin percentage of less than 0.1% of said paste. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An essentially resin free paste consisting essentially of by weight:
- from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt;
from about 2% to about 24% of a glass composition comprising, by weight on an oxide basis; about 40-65% Ag2 O about 15-35% V2 O5 about 5-20% TeO2 and about 0-30% of at least one of a group consisting of PbO2 and Pb3 O4 wherein said conductive metallic particles and said glass composition have a ratio by weight between about 8;
1 and about 24;
1;about 8-15% of an organic solvent; and a resin percentage of less than 0.1% of said paste. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
- from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt;
Specification
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Current AssigneeLoctite Corporation (Henkel AG & Co KGaA)
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Original AssigneeQuantum Materials, Inc. (California) (Thermo Fisher Scientific Incorporated)
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InventorsPeck, David M., Dietz, Raymond L.
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Primary Examiner(s)JONES, DEBORAH D
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Application NumberUS08/654,852Time in Patent Office461 DaysField of Search501/41, 501/17, 501/19, 501/20, 106/1.14US Class Current501/41CPC Class CodesC03C 3/122 containing oxides of As, Sb...C03C 8/14 Glass frit mixtures having ...C03C 8/18 containing free metalsC03C 8/24 Fusion seal compositions be...
