Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal
First Claim
1. A method for use in semiconductor device fabrication comprising the steps of:
- (a) forming over a semiconductor substrate a semiconductor device having a bonding pad;
(b) forming over the semiconductor device a layer having an opening which exposes a portion of the bonding pad;
(c) forming a bump comprising gold over the exposed portion of the bonding pad; and
(d) annealing the bump with a rapid thermal anneal.
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Accused Products
Abstract
A rapid thermal anneal (RTA) process minimizes the intermixing of materials between a bump and a bonding pad so as to provide for a more reliable and durable interconnect between the bump and the bonding pad and so as to allow the probing of wafers prior to bumping. A barrier layer is formed over the bonding pads of devices formed over a semiconductor substrate. Bumps are then formed over the bonding pads and are annealed for a short time at a high temperature so as to soften the bumps for later assembly in a semiconductor package. As a result of this quick annealing process, the intermixing of materials between the bumps and the bonding pads is minimized. This is so despite any decreased step coverage of the barrier layer over probe marks on the bonding pads which resulted from testing the wafer. Accordingly, wafers may now be tested prior to bumping, thus saving the cost, time, and process steps typically incurred in bumping wafers having a zero or low yield of properly functioning semiconductor devices.
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Citations
27 Claims
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1. A method for use in semiconductor device fabrication comprising the steps of:
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(a) forming over a semiconductor substrate a semiconductor device having a bonding pad; (b) forming over the semiconductor device a layer having an opening which exposes a portion of the bonding pad; (c) forming a bump comprising gold over the exposed portion of the bonding pad; and (d) annealing the bump with a rapid thermal anneal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 18, 19)
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11. A method for use in semiconductor device fabrication comprising the steps of:
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(a) forming over a semiconductor substrate a semiconductor device having a bonding pad; (b) forming over the semiconductor device a layer having an opening which exposes a portion of the bonding pad; (c) probing the bonding pad to test the semiconductor device; (d) forming, after the probing step (c), a bump comprising gold over the exposed portion of the probed bonding pad; (e) annealing the bump with a rapid thermal anneal; and (f) forming an interconnection between the bump and a semiconductor package. - View Dependent Claims (12, 13, 14, 15, 16, 17, 20, 21)
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22. A method for use in semiconductor device fabrication comprising the steps of:
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(a) forming over a semiconductor substrate a semiconductor device having a bonding pad; (b) forming over the semiconductor device a passivation layer having an opening which exposes a portion of the bonding pad; (c) probing the bonding pad to test the semiconductor device; (d) forming, after the probing step (c), a barrier layer over the exposed portion of the probed bonding pad; (e) forming a bump comprising gold over the barrier layer; (f) annealing the bump with a rapid thermal anneal by heating the bump at a temperature between approximately 425 degrees Celsius and approximately 475 degrees Celsius for a period of time between approximately 20 seconds and approximately 40 seconds; and (g) forming an interconnection between the bump and a semiconductor package. - View Dependent Claims (23, 24, 25, 26, 27)
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Specification