Vertical power mosfet having thick metal layer to reduce distributed resistance

• US 5,665,996 A
• Filed: 12/30/1994
• Issued: 09/09/1997
• Est. Priority Date: 12/30/1994
• Status: Expired due to Term

• Current Assignee: Siliconix Incorporated (Vishay Intertechnology Incorporated)
• Original Assignee: Siliconix Incorporated (Vishay Intertechnology Incorporated)
• Inventors: Williams, Richard K., Kasem, Mohammad
• Primary Examiner(s): FAHMY, WAEL M
• Application Number:
  US08/367,486
• Time in Patent Office: 984 Days
• Field of Search: 257/766, 257/737, 257/751, 257/753, 257/139, 257/401, 257/341, 257/329, 257/330, 257/331, 257/332, 257/335, 257/784, 257/728, 257/690
• US Class Current: 257/401
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05082 Two-layer arrangements
• CPC Class Codes: H01L 2224/05083 Three-layer arrangements
• CPC Class Codes: H01L 2224/05118 Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06051 Bonding areas having different shapes
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/4846 with multiple bonds on the same bonding area
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/48644 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48655 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48744 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48755 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/49111 : the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 23/4824 : Pads with extended contours, e.g. grid structure, branch structure, finger structure
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 29/41741 : for vertical or pseudo-vertical devices
• CPC Class Codes: H01L 29/73 : Bipolar junction transistors
• CPC Class Codes: H01L 29/7395 : Vertical transistors, e.g. vertical IGBT
• CPC Class Codes: H01L 29/7802 : Vertical DMOS transistors, i.e. VDMOS transistors
• CPC Class Codes: H01L 29/7811 : with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7813 : with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/10162 : with a square active surface
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

The on-resistance of a vertical power transistor is substantially reduced by forming a thick metal layer on top of the relatively thin metal layer that is conventionally used to make contact with the individual transistor cells in the device. The thick metal layer is preferably plated electrolessly on the thin metal layer through an opening that is formed in the passivation layer.

Claims

1. A vertical power transistor comprising:

a die comprising a semiconductor material;

a plurality of transistor cells arrayed on said die, each of said cells containing a first region located near a surface of said die and a control element and being arranged so as to permit a current to flow between said first region and a second region located at a position separated from said surface, the magnitude of said current being controlled by an electrical signal applied to said control element;

a thin metal layer in electrical contact with said first region of each of said cells;

a thick metal layer formed in electrical contact with said thin metal layer so as to form a low-resistance path between said first region of each of said cells; and

a passivation layer overlying a portion of a top surface of said die, said passivation layer abutting a lateral edge of said thick metal layer but not overlapping a top surface of said thick metal layer, at least a portion of a top surface of said passivation layer remaining uncovered.

2. The power transistor of claim 1 wherein said passivation layer comprises silicon nitride.

3. The power transistor of claim 1 wherein said thick metal layer overlaps an edge of said passivation layer.

4. The power transistor of claim 1 wherein said passivation layer overlaps a portion of said thin metal layer.

5. The power transistor of claim 1 wherein said thick metal layer includes an adhesion sublayer in contact with said thin metal layer.

6. The power transistor of claim 5 wherein said thick metal layer includes a thick metal sublayer in contact with said adhesion layer.

7. The power transistor of claim 6 wherein said thick metal layer includes a surface sublayer in contact with said thick metal sublayer.

8. The power transistor of claim 7 wherein said surface sublayer comprises gold.

9. The power transistor of claim 6 wherein said thick metal sublayer comprises nickel.

10. The power transistor of claim 5 wherein said adhesion sublayer comprises zinc.

11. The power transistor of claim 1 wherein said power transistor comprises a MOSFET and said control element comprises a gate formed in a trench in said die.

12. The power transistor of claim 11 further comprising a gate bonding pad.

13. The power transistor of claim 12 wherein said gate bonding pad is formed of the same material as said thick metal layer.

14. The power transistor of claim 1 wherein said power transistor comprises a planar vertical DMOS field effect transistor.

15. The power transistor of claim 1 wherein said power transistor comprises a vertical bipolar transistor.

16. The power transistor of claim 1 wherein said power transistor comprises a vertical insulated gate bipolar transistor.

17. The power transistor of claim 1 further comprising a bond wire, said bond wire being bonded to said thick metal layer.

18. The power transistor of claim 17 wherein said thick metal layer comprises a sandwich of nickel, zinc and gold sublayers.

19. The power transistor of claim 17 wherein said bond wire comprises aluminum.

20. The power transistor of claim 17 wherein said bond wire comprises gold.

21. The power transistor of claim 1 further comprising:

a pattern of trenches extending into said die, said pattern of trenches defining said transistor cells; and

a gate disposed in said trenches, said gate being insulated from said semiconductor material by an insulating layer.

22. The power transistor of claim 21 wherein said first region comprises a source region and said second region comprises a drain region, said power transistor further comprising a body region adjacent said source region.

23. The power transistor of claim 22 wherein said body region extends to said surface in each of said transistor cells, said thin metal layer making electrical contact with said body region in each of said transistor cells.

24. The power transistor of claim 21 wherein said die comprises an epitaxial layer, said trenches extending into said epitaxial layer.

25. The power transistor of claim 1 wherein a thickness of said thin metal layer is in the range of 0.8 to 2.8 μ

m.

26. The power transistor of claim 1 wherein a thickness of said thick metal layer is in the range of 10 to 30 μ

m.