Copper alloy sheet for connectors and connectors formed of same

• US 5,667,752 A
• Filed: 03/20/1996
• Issued: 09/16/1997
• Est. Priority Date: 12/01/1995
• Status: Expired due to Term

• Current Assignee: Mitsubishi Materials Corporation
• Original Assignee: Mitsubishi Shindoh Company Limited (Mitsubishi Materials Corporation)
• Inventors: Kumagai, Seiji, Suzuki, Takeshi, Kuwahara, Manpei, Futatsuka, Rensei
• Primary Examiner(s): Ip, Sikyin
• Application Number:
  US08/618,829
• Time in Patent Office: 545 Days
• Field of Search: 420/494, 420/499, 148/432
• US Class Current: 420/494
• CPC Class Codes: C22C 9/00 Alloys based on copper

Abstract

There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of:

Mg: 0.3-2% by weight;

P: 0.001-0.02% by weight;

C: 0.0002-0.0013% by weight;

O: 0.0002-0.001% by weight; and

Cu and inevitable impurities: the balance. The copper alloy sheet has a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 μm are evenly dispersed in a matrix of the copper alloy sheet. The copper alloy sheet is excellent not only in tensile strength, elongation, electric conductivity and spring limit value before forming, but also in spring limit value after forming, and high-temperature creep strength.

Claims

1. A copper alloy sheet for connectors, having a chemical composition consisting essentially of:

Mg;

0.3-2% by weight;

P;

0.001-0.02% by weight;

C;

0.0002-0.0013% by weight;

O;

0.0002-0.001% by weight; and

Cu and inevitable impurities;

the balance;

said copper alloy sheet having a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 μ

m are evenly dispersed in a matrix of said copper alloy sheet.

2. A copper alloy sheet as claimed in claim 1, having a chemical composition consisting essentially of:

Mg;

0.3-1.2% by weight;

P;

0.003-0.012% by weight;

C;

0.0003-0.0010% by weight;

O;

0.0003-0.0008% by weight; and

Cu and inevitable impurities;

the balance.

3. A connector formed of a copper alloy sheet having a chemical composition consisting essentially of:

Mg;

0.3-2% by weight;

P;

0.001-0.02% by weight;

C;

0.0002-0.0013% by weight;

O;

0.0002-0.001% by weight; and

Cu and inevitable impurities;

the balance;

said copper alloy sheet having a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 μ

m are evenly dispersed in a matrix of said copper alloy sheet.

4. A connector as claimed in claim 3, wherein said copper alloy sheet has a chemical composition consisting essentially of:

Mg;

0.3-1.2% by weight;

P;

0.003-0.012% by weight;

C;

0.0003-0.0010% by weight;

O;

0.0003-0.0008% by weight; and

CU and inevitable impurities;

the balance.