Method for processing semiconductor wafer with reduced particle contamination during saw
First Claim
1. A method of processing a semiconductor wafer, comprising the steps of:
- a) defining primary circuit scribes in said wafer to define an active circuit processing area;
b) defining a semiconductor circuit in said active circuit processing area; and
c) defining at least one secondary scribe in said wafer being continuous with said primary circuit scribe and extending to proximate said wafer edge, said secondary scribe extending between non-active wafer portions of said semiconductor wafer.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of processing a semiconductor wafer (12) to form micromechanical devices. Extended scribe lines (20) are provided from centrally located integrated circuit scribe lines (16) to provide a saw street that extends to the perimeter of the wafer. Micromechanical devices (14), including those of the DMD type, can be fabricated without a layer of protective oxide while reducing the generation of conductive particles during the wafer saw process which could otherwise degrade the operation of the micromechanical devices having movable elements. The extended scribe lines (20) are fabricated at the same time that the conventional scribe lines (16) are formed about the integrated circuits (14).
-
Citations
8 Claims
-
1. A method of processing a semiconductor wafer, comprising the steps of:
-
a) defining primary circuit scribes in said wafer to define an active circuit processing area; b) defining a semiconductor circuit in said active circuit processing area; and c) defining at least one secondary scribe in said wafer being continuous with said primary circuit scribe and extending to proximate said wafer edge, said secondary scribe extending between non-active wafer portions of said semiconductor wafer. - View Dependent Claims (2, 3, 8)
-
-
4. A semiconductor wafer, comprising:
-
a) a primary circuit scribe in said wafer defining at least one active circuit processing area; b) a semiconductor circuit defined in said active circuit processing area; and c) at least one secondary scribe extending from said primary circuit scribe to proximate said wafer edge, said secondary scribe extending between nonactive wafer portions of said semiconductor wafer. - View Dependent Claims (5, 6, 7)
-
Specification