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Method for processing semiconductor wafer with reduced particle contamination during saw

  • US 5,668,062 A
  • Filed: 08/23/1995
  • Issued: 09/16/1997
  • Est. Priority Date: 08/23/1995
  • Status: Expired due to Term
First Claim
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1. A method of processing a semiconductor wafer, comprising the steps of:

  • a) defining primary circuit scribes in said wafer to define an active circuit processing area;

    b) defining a semiconductor circuit in said active circuit processing area; and

    c) defining at least one secondary scribe in said wafer being continuous with said primary circuit scribe and extending to proximate said wafer edge, said secondary scribe extending between non-active wafer portions of said semiconductor wafer.

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