Method for making an interface connection through an insulating part

• US 5,670,063 A
• Filed: 02/12/1996
• Issued: 09/23/1997
• Est. Priority Date: 05/26/1991
• Status: Expired due to Term

• Current Assignee: Endress+Hauser GmbH+Co (ENDRESS)
• Original Assignee: Endress+Hauser GmbH+Co (ENDRESS)
• Inventors: Klahn, Thomas, Hegner, Frank
• Primary Examiner(s): Ledynh, Bot L.
• Application Number:
  US08/599,677
• Time in Patent Office: 589 Days
• Field of Search: 219/129, 219/136, 219/137 R, 219/137 WW, 219/78.01, 219/85.1, 219/85.12, 219/85.13, 219/85.22, 29/837-840, 29/845, 228/179.1, 228/262.9, 174/143, 174/152 R, 174/152 GM, 361/302
• US Class Current: 219/85.22
• CPC Class Codes: C04B 2235/6581 Total pressure below 1 atmosphere, e.g. vacuum
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/126 wherein the active component for bonding is not the largest fraction of the interlayer
• CPC Class Codes: C04B 2237/127 The active component for bonding being a refractory metal
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/348 Zirconia, hafnia, zirconates or hafnates
• CPC Class Codes: C04B 2237/365 Silicon carbide
• CPC Class Codes: C04B 2237/40 Metallic
• CPC Class Codes: C04B 2237/403 Refractory metals
• CPC Class Codes: C04B 2237/62 Forming laminates or joined articles comprising holes, channels or other types of openings
• CPC Class Codes: C04B 2237/64 Forming laminates or joined articles comprising grooves or cuts
• CPC Class Codes: C04B 2237/765 at least one member being a tube
• CPC Class Codes: C04B 2237/84 Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
• CPC Class Codes: C04B 2237/88 Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture

Abstract

This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient of thermal expansion less than that of the insulating part (1), wherein at least one end of the lead, if it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, or, if it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material (5'"'"'), since in the liquid phase, the active brazing material moves into the gap between the wall of the hole (2) and the lead (4, 17) due to capillary action. Thus, the available materials (insulating material, metals having a smaller coefficient of thermal expansion than the insulating part, active brazing materials) can be used in a different and novel manner such that the use of a lead covered with active brazing material can be dispensed with.

Claims

1. A method producing an interface connection through a hole in a high-temperature-resistant and vacuum-proof insulating part made of one of ceramic, glass and a single crystal, which interface connection comprises a metallic lead inserted into the hole and having a coefficient of thermal expansion less than that of the insulating part, wherein at least one end of the lead, when it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, and when it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material, with at least one conductive layer provided on at least one of the surfaces of the insulating part and making contact to the lead, said method comprising the following features:

depositing the at least one conductive layer on the insulating part provided with the hole, which has a spot facing on the conductive-layer side, such that the conductive layer extends into the hole;

inserting the lead into the hole;

widening an end of the lead which is located on the conductive-layer side, such that said end and the conductive layer extending into the hole are cold-welded together;

depositing a sufficient amount of active brazing material consisting essentially of a metal and an active metal on an opposite side of the insulating part from the conductive layer, wherein the active metal content is just sufficient for wetting the points of contact with the insulating part, and

heating the active brazing material to a temperature above the melting point of the active brazing material until the latter has completely melted so that the active brazing material enters and moves into the hole around the lead by capillary action and wets the lead and the hole, and subsequently allowing it to cool down.

2. A method as claimed in claim 1 wherein the conductive layer is deposited by sputtering.

3. A method as claimed in claim 2, wherein the heating step is in a vacuum having a residual-gas pressure of less than 0.01 μ

bar (=1 mPa).

4. A method as claimed in claim 2, wherein the heating step is in a gas atmosphere having a pressure not exceeding 10 mbars (=1 kPa).

5. A method as claimed in claim 2, wherein the heating step is in a gas atmosphere comprising an inert gas or a reactive gas or of a mixture of inert and/or reactive gases.

6. A method as claimed in claim 1 wherein the heating step is in a vacuum having a residual-gas pressure of less than 0.01 μ

bar (=1 mPa).

7. A method as claimed in claim 1 wherein the heating step is in a gas atmosphere having a pressure not exceeding 10 mbars (=1 kPa).

8. A method as claimed in claim 1 wherein the heating step is in a gas atmosphere comprising an inert gas or a reactive gas or of a mixture of inert and/or reactive gases.