×

Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated

  • US 5,670,066 A
  • Filed: 03/17/1995
  • Issued: 09/23/1997
  • Est. Priority Date: 03/17/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. A method of treating a workpiece with a plasma in an evacuated chamber including a source of the plasma and a chuck for selectively holding the workpiece, the chuck being an electrostatic chuck having first and second electrically insulated electrodes, comprising the steps of:

  • placing the workpiece on the chuck in the evacuated chamber,then automatically detecting whether the workpiece is properly positioned on the chuck,activating the chuck to hold the workpiece in situ in response to the automatic detecting step indicating the workpiece is properly positioned on the chuck, the chuck being activated to hold the workpiece in situ by applying attractive electrostatic force to the workpiece via the electrodes,the automatic detecting step being performed by measuring the capacitance across the electrodes prior to application of the electrostatic force to the workpiece via the electrodes and by determining a measure of the capacitance difference across the electrodes prior to and after the workpiece being placed on the chuck, andthen treating the workpiece held in situ on the chuck with the plasma.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×