Method and apparatus for vacuum deposition of highly ionized media in an electromagnetic controlled environment
First Claim
1. A method of vacuum depositing a coating on a substrate, comprising:
- providing an evaporant in a vacuum process chamber;
ionizing the evaporant using an external power source to form a plasma within the process chamber;
generating a non-uniform magnetic field within the process chamber having the configuration of a "magnetic bottle" to contain the plasma; and
thenmoving the substrate into a deposition volume of the "magnetic bottle" along a direction of motion generally parallel to a primary axis of the "magnetic bottle" within the deposition volume to deposit the coating on the substrate to a desired thickness.
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Accused Products
Abstract
A method and apparatus for vacuum depositing a coating onto a substrate are provided. The method includes the steps of: introducing an evaporant into a magnetically defined deposition region of a vacuum process chamber, ionizing the evaporant to form a plasma; generating a "magnetic bottle" magnetic field configuration to define the deposition region and to confine the plasma to the deposition region, further increasing the percentage ionization of the plasma to form a highly ionized media; creating a static dc electric field that is generally perpendicular to the magnetic field in the deposition region and parallel to the plane of the substrate; and then moving the substrate through the highly ionized media with the plane of the substrate and its direction of motion generally parallel to the magnetic field lines. The method of the invention is particularly suited to deposition of any atomistic evaporant onto intermediate-sized substrates.
72 Citations
21 Claims
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1. A method of vacuum depositing a coating on a substrate, comprising:
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providing an evaporant in a vacuum process chamber; ionizing the evaporant using an external power source to form a plasma within the process chamber; generating a non-uniform magnetic field within the process chamber having the configuration of a "magnetic bottle" to contain the plasma; and
thenmoving the substrate into a deposition volume of the "magnetic bottle" along a direction of motion generally parallel to a primary axis of the "magnetic bottle" within the deposition volume to deposit the coating on the substrate to a desired thickness. - View Dependent Claims (2, 3, 4, 5)
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6. A method for vacuum depositing a coating on a substrate comprising:
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vaporizing a deposition species in a vacuum process chamber to form an evaporant; forming a plasma by ionizing the evaporant using an external power source with electrodes located within the process chamber; generating a non-uniform magnetic field throughout the process chamber which contains the plasma and acts as a barrier to high energy electrons in the plasma striking the substrate said magnetic field having a primary axis; subjecting the ionized evaporant to a dc electric field with field vectors oriented generally perpendicular to the primary axis of the magnetic field and parallel to a face of the substrate; and
thenmoving the substrate through the plasma along a direction of motion generally parallel to the primary axis of the magnetic field to deposit the coating on the substrate to a desired thickness. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of vacuum deposition for plating a substrate having an exposed face with a metal, comprising:
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evaporating the metal in a vacuum process chamber to form an evaporant; ionizing the evaporant to form a plasma using electrodes mounted within the process chamber coupled to a rf power source; generating magnetic field lines in the process chamber to provide a barrier to high energy electrons in the plasma striking the substrate; subjecting the ionized evaporant to a dc electric field having electric field vectors oriented generally perpendicular to the magnetic field lines in a deposition volume; and
thenmoving the substrate through the deposition volume on an electrically biasable carrier with a face of the substrate held by the carrier generally parallel to the magnetic field lines to deposit the metal onto the face. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification