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Method of joining an electrical contact element to a substrate

  • US 5,670,418 A
  • Filed: 12/17/1996
  • Issued: 09/23/1997
  • Est. Priority Date: 12/17/1996
  • Status: Expired due to Fees
First Claim
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1. A method of joining an electrical contact element to an electrically conductive surface on a substrate, comprising:

  • coating said electrical contact element with gold;

    applying an outer coating of an electrically conductive material over said gold coating, said electrical conductive material of said outer coating having capillarity with respect to a preselected solder less than the capillarity of gold with respect to said preselected solder;

    joining said electrical contact element having said outer coating applied over said gold coating to said electrically conductive surface on a substrate by said preselected solder whereby a first portion of the outer coating on said electrical contact element is covered by said preselected solder and a second portion of the outer coating is not covered by said solder; and

    removing said second portion of the outer coating on the electrical contact element and thereby exposing the gold coating underlying said second portion of the outer coating.

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