Kangaroo multi-package interconnection concept

• US 5,671,121 A
• Filed: 01/30/1996
• Issued: 09/23/1997
• Est. Priority Date: 09/29/1994
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: McMahon, John Francis
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/594,334
• Time in Patent Office: 602 Days
• Field of Search: 361/688, 361/697, 361/702, 361/704, 361/717-719, 361/723, 361/760, 361/761, 361/764, 361/768, 361/773, 361/784, 361/785, 361/790, 361/791, 361/813, 174/16.3, 174/260, 165/185, 165/80.3, 257/675, 257/690, 257/686, 257/697, 257/706, 257/707, 257/713, 257/722-724, 257/787, 439/55, 439/68-70, 439/71, 439/74, 439/263, 439/264, 439/265, 439/485, 439/487, 439/525, 439/526
• US Class Current: 361/719
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/716 Coupling device provided on the PCB
• CPC Class Codes: H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.

Claims

1. A printed circuit board assembly, comprising:

a printed circuit board that has a first surface, an opposite second surface and a center opening;

a first electronic package that is mounted to said first surface of said printed circuit board and which has a plurality of first connectors extending from a bottom surface of said first electronic package, wherein at least one of said first connectors is mounted to said first surface of printed circuit board; and

,

a second electronic package that is adjacent to said second surface of said printed circuit board and has a second connector that extends from a top surface of said second electronic package and which is connected to one of said first connectors of said first electronic package through said center opening of said printed circuit board.

2. The assembly as recited in claim 1, wherein said first connectors are pins and said second connector is a are socket.

3. The assembly as recited in claim 1, further comprising an adapter that is mounted to said printed circuit board and which contains a socket that receives at least one of said first connectors of said first electronic package.

4. The assembly as recited in claim 1, further comprising an adapter that has a first socket that receives at least one of said first connectors of said first electronic package and a second socket that receives said second connector of said second electronic package.

5. The assembly as recited in claim 1, wherein said first electronic package is surface mounted to said printed circuit board.

6. The assembly as recited in claim 1, further comprising a heat sink mounted to said first electronic package.

7. The assembly as recited in claim 1, further comprising a heat sink mounted to said second electronic package.

8. The assembly as recited in claim 1, wherein said first electronic package contains a microprocessor and said second electronic package contains a memory device.

9. The assembly as recited in claim 1, wherein said first electronic package contains a microprocessor and said second electronic package contains a power supply.

10. The assembly as recited in claim 1, wherein said first electronic package contains a microprocessor and said second electronic package contains a voltage regulator.

11. A printed circuit board assembly, comprising:

a printed circuit board that has a center opening, said printed circuit board has a first surface and an opposite second surface;

a socket adapter that is mounted to said printed circuit board, said socket adapter having a socket and a center opening;

a first electronic package that is mounted to said first surface of said printed circuit board and which a plurality of pins that extend from a bottom surface of said first electronic package, wherein at least one of said first pins is mated with said socket of said printed circuit board and one of said first pins is mated with said socket of said socket adapter; and

,

a second electronic package that is adjacent to said second surface of said printed circuit board and has a connector that extends from a top surface of said second electronic package and which is connected to at least one of said pins of said first electronic package through said center openings of said socket adapter and said printed circuit board.

12. The assembly as recited in claim 11, further comprising a first heat sink mounted to said first electronic package and a second heat sink mounted to said second electronic package.

13. The assembly as recited in claim 11, wherein said first electronic package contains a microprocessor and said second electronic package contains a memory device.

14. The assembly as recited in claim 11, wherein said first electronic package contains a microprocessor and said second electronic package contains a power supply.

15. The assembly as recited in claim 11, wherein said first electronic package contains a microprocessor and said second electronic package contains a voltage regulator.

16. A printed circuit board assembly, comprising:

a printed circuit board that has a center opening, a first surface, an opposite second surface, and a surface pad on said first surface;

a first electronic package that is mounted to said first surface of said printed circuit board and which has a pin that extends from a bottom surface of said first electronic package, and a lead that is mounted to said surface pad of said printed circuit board; and

,

a second electronic package that is adjacent to said second surface of said printed circuit board and has a socket that extends from a top surface of said second electronic package and which is connected to said pin of said first electronic package through said center opening of said printed circuit board.

17. The assembly as recited in claim 16, further comprising a first heat sink mounted to said first electronic package and a second heat sink mounted to said second electronic package.

18. The assembly as recited in claim 16, wherein said first electronic package contains a microprocessor and said second electronic package contains a memory device.

19. The assembly as recited in claim 16, wherein said first electronic package contains a microprocessor and said second electronic package contains a power supply.

20. The assembly as recited in claim 16, wherein said first electronic package contains a microprocessor and said second electronic package contains a voltage regulator.

21. A printed circuit board assembly, comprising:

a printed circuit board that has a center opening, a first surface and an opposite second surface;

an adapter that is located within said center opening of said printed circuit board, said adapter having a plurality of sockets;

a first electronic package that is mounted to said first surface of said printed circuit board and which has a plurality of pins that extend from a bottom surface of said first electronic package, wherein at least one pin is mated with said socket of said adapter and mounted to said printed circuit board; and

,

a second electronic package that is adjacent to said second surface of said printed circuit board and has a pin that extends from a top surface of said second electronic package and which is connected to at least one of said sockets of said adapter.

22. The assembly as recited in claim 21, further comprising a first heat sink mounted to said first electronic package and a second heat sink mounted to said second electronic package.

23. The assembly as recited in claim 21, wherein said first electronic package contains a microprocessor and said second electronic package contains a memory device.

24. The assembly as recited in claim 21, wherein said first electronic package contains a microprocessor and said second electronic package contains a power supply.

25. The assembly as recited in claim 21, wherein said first electronic package contains a microprocessor and said second electronic package contains a voltage regulator.