Method of determining position offset of a pattern
First Claim
1. A method of determining position offset of a substrate to be processed having a plurality of unit patterns arranged on a main surface thereof, comprising the steps of:
- measuring position offset data at a plurality of predetermined unit patterns other than the unit patterns located outermost on said processed substrate among the unit patterns of said processed substrate;
calculating a predetermined error parameter based on said position offset data measured;
calculating a first linear error component of the unit pattern for which said position offset data is measured based on said error parameter;
calculating a first random error component of the unit pattern for which said position offset data is measured by subtracting said measured first linear component from said position offset data measured corresponding thereto;
calculating a second linear error component of the unit pattern located outermost on said processed substrate based on said error parameter;
calculating a second random error component corresponding to said second linear error component based on said first random error; and
calculating error data by adding each said second linear error component and said second random error component corresponding thereto.
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Abstract
A method of determining position offset is obtained which allows accurate determination of the magnitude of position offset even though the magnitudes of position offset of the outermost shots are not actually measured. According to the method of determining position offset, magnitudes of offset of the designated shots on the surface of a wafer other than the outermost shots are actually measured, and based on the measured magnitudes of offset, the magnitudes of position offset of the outermost shots are calculated and magnitudes of offset are calculated finally taking into consideration the magnitudes of position offset of the outermost shots. As a result, accurate error data can be derived even without actually measuring the magnitudes of offset of the outermost shots.
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Citations
10 Claims
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1. A method of determining position offset of a substrate to be processed having a plurality of unit patterns arranged on a main surface thereof, comprising the steps of:
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measuring position offset data at a plurality of predetermined unit patterns other than the unit patterns located outermost on said processed substrate among the unit patterns of said processed substrate; calculating a predetermined error parameter based on said position offset data measured; calculating a first linear error component of the unit pattern for which said position offset data is measured based on said error parameter; calculating a first random error component of the unit pattern for which said position offset data is measured by subtracting said measured first linear component from said position offset data measured corresponding thereto; calculating a second linear error component of the unit pattern located outermost on said processed substrate based on said error parameter; calculating a second random error component corresponding to said second linear error component based on said first random error; and calculating error data by adding each said second linear error component and said second random error component corresponding thereto. - View Dependent Claims (2, 3, 4, 5)
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6. A method of determining position offset of a substrate to be processed having a plurality of unit patterns arranged on a main surface thereof, comprising steps of:
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measuring position offset data at a plurality of predetermined unit patterns other than the unit pattern located outermost on said processed substrate among the unit patterns on said processed substrate; calculating a predetermined error parameter based on said position offset data measured; calculating a first linear error component of the unit pattern for which said position offset data is measured based on said error parameter; and calculating a first random error component of the unit pattern for which position offset data is measured by subtracting each said first linear error component calculated from said position offset data measured corresponding thereto; calculating a second linear component of each of the all unit patterns of said processed substrate based on said error parameter; calculating a second random error component corresponding to said second linear error component based on said first random error of the unit pattern for which said position offset data is measured; and calculating error data of said all unit patterns by adding each said second linear error component of said all unit patterns and said random error component corresponding thereto. - View Dependent Claims (7, 8, 9, 10)
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Specification