Method of forming a molded pulse oximeter sensor

• US 5,671,529 A
• Filed: 06/07/1995
• Issued: 09/30/1997
• Est. Priority Date: 07/24/1992
• Status: Expired due to Term

• Current Assignee: Sensormedics Corporation (Becton, Dickinson & Co)
• Original Assignee: Sensormedics Corporation (Becton, Dickinson & Co)
• Inventors: Nelson, Dale
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/473,733
• Time in Patent Office: 846 Days
• Field of Search: 29/883, 29/884, 29/825, 264/263, 264/274, 264/272.15
• US Class Current: 29/825
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A pulse oximeter sensor apparatus which is sealed against liquid penetration during its formation by overmolding, and methods for overmolding. The pulse oximeter sensor apparatus disclosed comprises a preform first section, oximeter sensor components, and an overmolded second section bonded to the preform first section during the overmolding process to form a liquid resistant seal comprising a mechanical bond of overlapping elements.

Claims

1. A method of forming a molded pulse oximeter sensor apparatus utilizing an overmolding step, comprising:

supplying a preform first section having an interior surface and an exterior surface;

securing oximeter sensing components in a fixed configuration to said interior surface of said preform first section so that the position of said sensing components will be maintained during overmolding; and

utilizing injection molding to overmold a second section which is bonded to said preform first section such that said sensing components are enclosed between said preform first section and said overmolded second section, and wherein the bond between said preform first section and said overmolded second section at their peripheries comprises a mechanical bond of overlapping elements.

2. The method of claim 1 wherein said mechanical bond of overlapping elements comprises protuberances extending from the surface of said preform first section along its periphery, said protuberances having a shape such that said protuberances are wider at a point more distant from the surface of said preform first section than at a point closer to the surface of said preform first section, and wherein said overmolded second section is formed surrounding said protuberances.

3. The method of claim 2 wherein said protuberances have a dovetail shape such that the narrowest portion of the dovetail is closer than its widest portion to the surface of said preform first section from which said protuberances extend.

4. The method of claim 2 wherein said protuberances extend perpendicularly from the surface of said preform first section.

5. The method of claim 1 wherein said bond formed during overmolding between said preform first section and said overmolded second section is resistant to penetration by liquid.

6. The method of claim 1 wherein said bond formed during overmolding between said preform first section and said overmolded second section prevents liquid from penetrating the bond and contacting the sensing components positioned between said first and second sections.

7. The method of claim 1 wherein said oximeter sensing components comprise a light source, a detector, and connecting wires.

8. The method of claim 1 further comprising supplying window compartments which interlock into position in cavities contained in said preform first section and which extend to the exterior surface of said preform first section, and into which window compartments the light source and detector sensing components are secured.

9. The method of claim 8 wherein said window compartments form a seal with said preform first section which is resistant to penetration by liquid.

10. The method of claim 1 wherein coffin molds are utilized to hold said preform first section and oximeter sensing components during the overmolding step, and wherein said coffin mold is inserted into the base mold during overmolding.