Multilayered printed board structure

• US 5,672,414 A
• Filed: 06/21/1994
• Issued: 09/30/1997
• Est. Priority Date: 06/25/1993
• Status: Expired due to Fees

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Okamoto, Kenji, Ichihara, Takao, Imamura, Kazuhiko, Nakajima, Yukio
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): JEWIK, PATRICK
• Application Number:
  US08/263,332
• Time in Patent Office: 1,197 Days
• Field of Search: 428/209, 428/210, 428/901, 361/746, 361/761, 361/792, 361/752, 361/720, 361/749
• US Class Current: 428/209
• CPC Class Codes: B32B 3/00 Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/045 Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4611 : by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Claims

1. A multilayered printed board structure, comprising:

an insulated metal substrate including an insulating layer laminated on a metallic plate as a base layer and a conductive layer on said insulating layer, and having first electronic components mounted on said insulated metal substrate;

at least one printed board laminated over a first side of said insulated metal substrate on which said first electronic components are mounted, and having second electronic components mounted on one or both sides of said printed board;

an insulating resin filling a space between said insulated metal substrate and said printed board;

said printed board or said insulation layer of said insulated metal substrate being divided into at least first and second portions, said first portion containing electronic parts similar in first operational characteristics; and

said second portion containing parts similar in second operation characteristics, said first and second operational characteristics being different; and

said portions of said printed board or said insulating layer formed of materials differing in physical properties and selected in relation to the operational characteristics of said electronic parts of said portion.

2. A multilayered printed board structure as claimed in claim 1, wherein said insulation resin has a high thermal conductivity.

3. A multilayered printed board structure as claimed in claim 1, wherein a through hole is formed in said at least one printed board to penetrate a conductor pattern provided on said at least one printed board.

4. A multilayered printed board structure as claimed in claim 1, further comprising a metallic pin for connecting conductor patterns provided on said boards facing to each other, said pin being buried along the thickness direction of said multilayered printed board structure.

5. A multilayered printed board structure as claimed in claim 1, wherein said multilayered printed board structure has a monolithic structure formed by applying a vacuum press to said boards and said insulation resin incorporated as prepregs between each of said boards.

6. A multilayered printed board structure as claimed in claim 1, wherein said multilayered printed board structure has a monolithic structure formed by injecting said insulation resin into a shaping mold after placing therein said at least one printed board having said mounted electronic components.

7. A multilayered printed board structure as claimed in claim 1, wherein said insulated metal substrate is larger than an outer periphery of said at least one printed board and said insulation resin over said insulated metal substrate, and a conductor pattern formed on a surface of said insulated metal substrate is exposed to form a connecting portion with an external circuit.

8. A multilayered printed board structure, comprising:

an insulated metal substrate including an insulating layer laminated on a metallic plate as a base layer and a conductive layer on said insulating layer, and having first electronic components mounted on said insulated metal substrate;

at least one printed board laminated over a first side of said insulated metal substrate on which said first electronic components are mounted, and having second electronic components mounted on one or both sides of said printed board;

an insulation resin filling a space between said insulated metal substrate and said printed board; and

wherein said at least one printed board laminated over said insulated metal substrate has a cut portion, and a substrate having thereon a through hole and an electrode pattern being fitted and buried in said cut portion.

9. A multilayered printed board structure as claimed in claim 8, wherein

said printed board or said insulation layer of said insulated metal substrate is divided into at least first and second portions, said first portion containing electronic parts similar in first operational characteristics;

and

said second portion containing parts similar in second operation characteristics, said first and second operational characteristics being different; and

said portions of said printed board or said insulating layer formed of materials differing in physical properties and selected in relation to the operational characteristics of said electronic parts of said portion.

10. A multilayered printed board structure as claimed in claim 8, wherein said insulation resin has a high thermal conductivity.

11. A multilayered printed board structure as claimed in claim 8, including a through hole formed in said at least one printed board to penetrate a conductor pattern provided on said at least one printed board.

12. A multilayered printed board structure as claimed in claim 8, further comprising a metallic pin for connecting conductor patterns provided on said boards facing to each other, said pin being buried along the thickness direction of said multilayered structure printed structure.

13. A multilayered printed board structure as claimed in claim 8, wherein said multilayered printed board structure has a monolithic structure formed by applying a vacuum press to said boards and said insulation resin incorporated as prepregs between each of said boards.

14. A multilayered printed board structure as claimed in claim 8, wherein said multilayered printed board structure has a monolithic structure formed by injecting said insulation resin into a shaping mold after placing therein said at least one printed board having said mounted electronic components.

15. A multilayered printed board structure as claimed in claim 8, wherein said insulated metal substrate is larger than an outer periphery of said at least one printed board and said insulation resin over said insulated metal substrate, and a conductor pattern formed on a surface of said insulated metal substrate is exposed to form a connecting portion with an external circuit.

16. A multilayered printed board structure, comprising:

an insulated metal substrate including an insulating layer laminated on a metallic plate as a base layer and a conductive layer on said insulating layer, and having first electronic components mounted on said insulated metal substrate;

at least one printed board laminated over a first side of said insulated metal substrate on which said first electronic components are mounted, and having second electronic components mounted on one or both sides of said printed board; and

an insulation resin filling a space between said insulated metal substrate and said printed board, an outer edge of said insulated metal substrate being folded upward to provide a casing which surrounds said at least one printed board laminated over said insulated metal substrate.

17. A multilayered printed board structure as claimed in claim 16, said insulation resin having a high thermal conductivity.

18. A multilayered printed board structure as claimed in claim 16, wherein

said printed board or said insulation layer of said insulated metal substrate is divided into at least first and second portions, said first portion containing electronic parts similar in first operational characteristics, and

said second portion containing parts similar in second operation characteristics, said first and second operational characteristics being different;

and

said portions of said printed board or said insulating layer formed of materials differing in physical properties and selected in relation to the operational characteristics of said electronic parts of said portion.

19. A multilayered printed board structure as claimed in claim 16, wherein a through hole is formed in said at least one printed board to penetrate a conductor pattern provided on said at least one printed board.

20. A multilayered printed board structure as claimed in claim 16, said at least one printed board laminated over said insulated metal substrate having a cut portion, and a substrate having thereon a through hole and an electrode pattern fitted and buried in said cut portion.

21. A multilayered printed board structure as claimed in claim 16, further comprising a metallic pin for connecting conductor patterns provided on said boards facing to each other, said pin being burled along the thickness direction of said multilayered structure printed structure.

22. A multilayered printed board structure as claimed in claim 16, wherein said multilayered printed board structure has a monolithic structure formed by applying a vacuum press to said boards and said insulation resin incorporated as prepregs between each of said boards.

23. A multilayered printed board structure as claimed in claim 16, wherein said multilayered printed board structure has a monolithic structure formed by injecting said insulation resin into a shaping mold after placing therein said at least one printed board having said mounted electronic components.

24. A multilayered printed board structure as claimed in claim 16, wherein said insulated metal substrate is larger than an outer periphery of said at least one printed board and said insulation resin over said insulated metal substrate, and a conductor pattern formed on a surface of said insulated metal substrate being exposed to form a connecting portion with an external circuit.