Surface inspection system for detecting various surface faults

• US 5,672,886 A
• Filed: 08/02/1995
• Issued: 09/30/1997
• Est. Priority Date: 08/12/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Fukazawa, Chiaki
• Primary Examiner(s): ALLEN, STEPHONE B
• Application Number:
  US08/510,302
• Time in Patent Office: 790 Days
• Field of Search: 250/559.45, 250/559.46, 356/237, 356/238, 356/429-431, 382/149, 382/159
• US Class Current: 250/559.46
• CPC Class Codes: G01N 21/8903 using a multiple detector array
• CPC Class Codes: G06T 2207/30108 Industrial image inspection
• CPC Class Codes: G06T 7/0004 Industrial image inspection

Abstract

A surface inspection system including, a detection circuit for detecting an image of a surface fault in a runing sheet material, a fault area judgement circuit connected to the detection circuit for receiving the image and for determining a fault area including a cluster fault composed of the same type of fault parts, and a recognition circuit connected to the detection circuit for receiving the image, connected to the fault area judgement circuit for receiving the fault area, and for recognizing a type and a grade of the cluster fault included in the fault area.

Claims

1. A surface inspection system, comprising:

detection means for detecting an image of a surface fault in a running sheet material;

fault area judgement means connected to said detection means for receiving said image and for determining a fault area including a cluster fault composed of the same type of fault parts; and

recognition means connected to said detection means for receiving said image, connected to said fault area judgement means for receiving said fault area, and for recognizing a type and a grade of said cluster fault included in said fault area.

2. A surface inspection system, comprising:

detection means for detecting an image of a surface fault in a running sheet material;

fault area judgement means connected to said detection means for receiving said image and for determining a fault area including a cluster fault composed of the same type of fault parts; and

recognition means connected to said detection means for receiving said image, connected to said fault area judgement means for receiving said fault area, and for recognizing a type and a grade of said cluster fault included in said fault area;

wherein said fault are judgement means includes;

a binary imaging circuit connected to said detection means for receiving said image and for binary imaging said image to generate binary image patterns;

a grouping judgement circuit connected to said binary imaging circuit for receiving said binary image patterns and for judging a fault composed of the same type of said fault parts as said cluster fault from said binary image patterns; and

a segmentation circuit connected to said grouping judgement circuit for receiving said cluster fault and for determining said fault area including said cluster fault by judging the separation of said cluster fault.

3. The surface inspection system according to claim 2, wherein:

said grouping judgement circuit judges a specified area around pixels of said fault parts in said binary image patterns as said cluster fault by one of an expansion processing and an enlargement processing.

4. The surface inspection system according to claim 2, wherein:

said segmentation circuit determines said fault area including said cluster fault by judging the connectivity of each of pixels of said cluster fault and numbering said pixels.

5. The surface inspection system according to claim 2 wherein:

said segmentation circuit takes projections of said cluster fault in the length direction and the width direction of said running sheet material and determines said fault area including said cluster fault from said projections.

6. The surface inspection system according to claim 5, wherein:

said segmentation circuit takes said projections of said cluster fault in the width direction as a width projection at each end of length projection of said cluster fault in the length direction, and determines a rectangular area determined by said width projection and said length projection as said fault area including said cluster fault.

7. A surface inspection system, comprising:

a detector detecting an image of a surface fault in a running sheet material;

a fault area judgement circuit connected to said detector and receiving said image and for determining a fault area including a cluster fault composed of the same type of fault parts; and

a recognition circuit connected to said detector and receiving said image, connected to said fault area judgement circuit and receiving said fault area, and for recognizing a type and a grade of said cluster fault included in said fault area.

8. A surface inspection system, comprising:

a detector detecting an image of a surface fault in a running sheet material;

a fault area judgement circuit connected to said detector and receiving said image and for determining a fault area including a cluster fault composed of the same type of fault parts; and

a recognition circuit connected to said detector and receiving said image, connected to said fault area judgement circuit and receiving said fault area, and for recognizing a type and a grade of said cluster fault included in said fault area;

wherein said fault are judgement circuit includes;

a binary imaging circuit connected to said detection means for receiving said image and for binary imaging said image to generate binary image patterns;

a grouping judgement circuit connected to said binary imaging circuit for receiving said binary image patterns and for judging a fault composed of the same type of said fault parts as said cluster fault from said binary image patterns; and

a segmentation circuit connected to said grouping judgement circuit for receiving said cluster fault and for determining said fault area including said cluster fault by judging the separation of said cluster fault.

9. The surface inspection system according to claim 8, wherein:

said grouping judgement circuit judges a specified area around pixels of said fault parts in said binary image patterns as said cluster fault by one of an expansion processing and an enlargement processing.

10. The surface inspection system according to claim 8, wherein:

said segmentation circuit determines said fault area including said cluster fault by judging the connectivity of each of pixels of said cluster fault and numbering said pixels.

11. The surface inspection system according to claim 8, wherein:

said segmentation circuit takes projections of said cluster fault in the length direction and the width direction of said running sheet material and determines said fault area including said cluster fault from said projections.

12. The surface inspection system according to claim 11, wherein:

said segmentation circuit takes said projections of said cluster fault in the width direction as-a width projection at each end of length projection of said cluster fault in the length direction, and determines a rectangular area determined by said width projection and said length projection as said fault area including said cluster fault.