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Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package

  • US 5,672,911 A
  • Filed: 05/30/1996
  • Issued: 09/30/1997
  • Est. Priority Date: 05/30/1996
  • Status: Expired due to Term
First Claim
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1. A semiconductor device assembly, comprising:

  • a package substrate comprising a top surface, a bottom surface, first and second conductive patterns, and first, second and third dielectric layers,the first dielectric layer disposed between the top surface and the first conductive pattern, the second dielectric layer disposed between the first and second conductive patterns, and the third dielectric layer disposed between the second conductive pattern and the bottom surface,the bottom surface having a plurality of first external connectors, a plurality of second external connectors, a plurality of third external connectors, a plurality of fourth external connectors, and a plurality of signal external connectors,the first conductive pattern having a first plane and a third plane, the first plane connected to the plurality of first external connectors, and the third plane connected to the plurality of third external connectors,the second conductive pattern having a second plane and a fourth plane, the second plane connected to the plurality of second external connectors, and the fourth plane connected to the plurality of fourth external connectors, the first and second planes positioned in a biplanar relationship for forming an electrical capacitance, and the third and fourth planes positioned in a biplanar relationship for forming an electrical capacitance; and

    a semiconductor die having core circuits and input-output circuits, said semiconductor die located on the top surface of said package substrate, said semiconductor die comprising;

    a plurality of first power bond pads for the core circuits, the plurality of first power bond pads connected to the first plane,a plurality of second power bond pads for the core circuits, the plurality of second power bond pads connected to the second plane,a plurality of third power bond pads for the input-output circuits, the plurality of third power bond pads connected to the third plane,a plurality of fourth power bond pads for the input-output circuits, the plurality of fourth power bond pads connected to the fourth plane, thereby decoupling the core circuits of said semiconductor die from the input-output circuits of said semiconductor die, anda plurality of signal bond pads, the plurality of signal bond pads connected to the plurality of signal external connectors of said package substrate.

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