Apparatus and method for mounting an activity sensor or other component within a pacemaker using a contoured hybrid lid

• US 5,674,260 A
• Filed: 02/23/1996
• Issued: 10/07/1997
• Est. Priority Date: 02/23/1996
• Status: Expired due to Term

• Current Assignee: Pacesetter Incorporated (Abbott Laboratories)
• Original Assignee: Pacesetter Incorporated (Abbott Laboratories)
• Inventors: Weinberg, Alvin H.
• Primary Examiner(s): Jastrzab, Jeffrey R.
• Application Number:
  US08/604,633
• Time in Patent Office: 592 Days
• Field of Search: 607/1, 607/2, 607/5, 607/9, 607/36, 607/116, 607/119
• US Class Current: 607/36
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing

Abstract

A cardiac stimulation device contains an electronics package having a hybrid circuit structure enclosed by a contoured lid design. The contoured lid of the electronics package has a multi-level surface structure which conforms to a multi-level design of the hybrid circuit structure. Mounting the electronics package within a housing of the cardiac stimulation device creates an isolated region formed between the contoured lid of the electronics package and an interior surface of the housing. An activity sensor, or other component of the cardiac stimulation device, may be placed within the isolated region to reduce the overall size of the device.

Claims

1. In an implantable cardiac stimulation device of the type having pulse generating means, a housing and a first electronic component mounted on the housing, an electronics package for packaging the pulse generating means, said electronics package comprising:

a substrate for mounting electronic components on a surface of the substrate;

a second electronic component situated on the surface of the substrate, the second electronic component extending a first distance above the surface of the substrate;

a third electronic component situated on the surface of the substrate, the third electronic component extending a second distance above the surface of the substrate; and

a contoured lid attached to the substrate and having a cover surface adapted to fit over the first and second electronic components, the cover surface having a first portion placed over the first component and a second portion placed over the second component, wherein the first and the second portions are offset to provide a multi-level contoured lid;

wherein, when the electronics package is placed within the housing, the first electronic component is adapted to fit within an isolated region which is formed between an exterior portion of the contoured lid and an interior surface of the housing.

2. The electronics package of claim 1, wherein the second electronic component is a single integrated circuit and the third electronic component comprises a platform having a first plurality of integrated circuits mounted thereon, the third electronic component enabling a second plurality of electronic components to be mounted on the substrate beneath the platform.

3. The electronics package of claim 1, wherein the contoured lid is formed with interior support structures for strengthening the contoured lid.

4. The electronics package of claim 1, wherein the first electronic component is a piezoelectric activity sensor.

5. The electronics package of claim 1, wherein the contoured lid is made of ceramic material.

6. A cardiac stimulation device comprising:

pulse generating means for generating stimulation pulses to a patient'"'"'s heart, the pulse generating means including a plurality of electronic components having different elevational levels;

a hybrid circuit assembly having means for mounting the plurality of electronic components upon a substrate surface;

a lid placed over the electronic components and attached to the substrate surface for confining the electronic components, the lid having a contoured surface forming a plurality of elevational levels corresponding to the elevational levels of the plurality of electronic components;

a housing for receiving the hybrid circuit assembly and attached lid such that an isolated region is formed within the housing between the contoured surface of the lid and an interior of the housing; and

sensor means, located within the isolated region and electrically coupled to the pulse generating means, for adjusting the rate of stimulation pulses.

7. The cardiac stimulation device of claim 6, wherein the sensor means is a patient activity sensor for sensing metabolic need.

8. The cardiac stimulation device of claim 6, wherein the plurality of electronic components comprises a first integrated circuit mounted at a first elevational level above the substrate surface and a second integrated circuit mounted at a second elevational level above the substrate surface.

9. The cardiac stimulation device of claim 6, wherein the lid is formed with interior support structures.

10. The cardiac stimulation device of claim 6, wherein the lid has a variable thickness corresponding to the placement of the plurality of electronic components upon the substrate surface.

11. The cardiac stimulation device of claim 6, wherein the lid is ceramic.

12. A method of creating a confined region within a pacemaker housing for mounting a component of the pacemaker comprises the following steps:

mounting the component of the pacemaker to an interior surface of the pacemaker housing;

constructing an electronics package having a circuit assembly covered by an associated lid, the lid having a contoured surface corresponding to a multi-level circuit structure of the circuit assembly; and

placing the electronics package within the pacemaker housing such that a recessed portion of the contoured lid surface forms an isolated region within the housing to receive the component mounted to the pacemaker housing, thereby creating the confined region between the contoured surface of the lid and the interior surface of the pacemaker housing.

13. A method of configuring the internal components of a pacemaker within a housing of the pacemaker wherein the internal components comprise a hybrid circuit assembly and at least one other individual component, the method of configuring comprising the following steps:

forming a contoured lid having a plurality of surface elevations corresponding to a plurality of elevations created by placement of circuit components within the hybrid circuit assembly;

placing the contoured lid over the hybrid circuit assembly to form an electronics package;

placing the electronics package within the housing of the pacemaker to create at least one isolated region between an exterior surface of the contoured lid and an interior surface of the pacemaker housing; and

mounting the at least one other individual component within the at least one isolated region within the pacemaker housing.

14. The method of claim 13, wherein the at least one other individual component is an activity sensor for detecting movement of a patient when the pacemaker is implanted within the patient.

15. The method of claim 13, wherein the contoured lid is made of ceramic material.