Method of producing a single piece package for semiconductor die
First Claim
1. A method for packaging a semiconductor die comprising:
- forming a package body with a die mounting location;
forming an interconnect opening through the package body, said opening extending from the die mounting location to a surface of the package body;
forming a pattern of grooves on the surface;
forming an insulating layer in the opening and on the surface;
forming pattern of conductors within the grooves;
mounting the die circuit side down on the die mounting location with a pattern of bond pads on the die accessible through the interconnect opening; and
forming an electrical interconnection between the pattern of bond pads and the pattern of conductors by wire bonding through the interconnect opening.
2 Assignments
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Accused Products
Abstract
A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are formed through the interconnect opening to establish electrical communication between the bond pads on the die and the conductors on the package body. The conductors on the package body can include solder bumps to permit the package to be flip chip mounted to a supporting substrate such as a printed circuit board or to be mounted in a chip-on-board configuration. The package can be fabricated by bulk micro-machining silicon wafers to form the package bodies, attaching the dice to the package bodies, and then singulating the wafer. Alternately the package body can be formed of a FR-4 material. In addition, multiple dice can be attached to a package body to form a multi-chip module.
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Citations
41 Claims
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1. A method for packaging a semiconductor die comprising:
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forming a package body with a die mounting location; forming an interconnect opening through the package body, said opening extending from the die mounting location to a surface of the package body; forming a pattern of grooves on the surface; forming an insulating layer in the opening and on the surface; forming pattern of conductors within the grooves; mounting the die circuit side down on the die mounting location with a pattern of bond pads on the die accessible through the interconnect opening; and forming an electrical interconnection between the pattern of bond pads and the pattern of conductors by wire bonding through the interconnect opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for packaging a semiconductor die comprising:
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providing a substrate; providing the die with a pattern of bond pads having solder bumps formed thereon; forming a die mounting location on the substrate to form a package body; forming an opening from the die mounting location to a surface of the package body; forming a pattern of grooves on the surface of the package body; forming a pattern of conductors within the grooves; aligning the bond pads on the die with the opening in the package body; placing the die circuit side down on the die mounting location; and electrically connecting the bond pads on the die to the conductors on the package body by reflowing the solder bumps through the opening onto the conductors. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method for packaging semiconductor dice comprising:
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providing a silicon wafer; forming a plurality of packages by etching a plurality of die mounting locations into the wafer, etching a plurality of through openings from a surface of the wafer to the die mounting locations, forming an insulating layer on the surface and sidewalls of the openings, forming a plurality of patterns of conductors on the surface, forming a plurality of grooves on the surface, and forming a plurality of patterns of solder balls within the plurality of grooves in electrical communication with the patterns of conductors; placing the dice circuit side down on the die mounting locations; singulating the packages from the wafer; and electrically connecting bond pads on the dice to the conductors on the packages by wire bonding or solder reflowing through the openings. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35)
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36. A method for packaging a semiconductor die having a pattern of bond pads comprising:
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forming a single piece package body with a die mounting location; forming an interconnect opening through the package body, said opening extending from the die mounting location to a surface of the package body; forming a pattern of conductors on the surface; forming a groove on the surface; forming metal bumps on the groove in electrical communication with the pattern of conductors; mounting the die circuit side down on the die mounting location with the pattern of bond pads on the die accessible through the interconnect opening; and forming an electrical interconnection through the interconnect opening to the pattern of bond pads on the die and the pattern of conductors on the package body. - View Dependent Claims (37, 38, 39, 40, 41)
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Specification