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Method of producing a single piece package for semiconductor die

  • US 5,674,785 A
  • Filed: 11/27/1995
  • Issued: 10/07/1997
  • Est. Priority Date: 11/27/1995
  • Status: Expired due to Term
First Claim
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1. A method for packaging a semiconductor die comprising:

  • forming a package body with a die mounting location;

    forming an interconnect opening through the package body, said opening extending from the die mounting location to a surface of the package body;

    forming a pattern of grooves on the surface;

    forming an insulating layer in the opening and on the surface;

    forming pattern of conductors within the grooves;

    mounting the die circuit side down on the die mounting location with a pattern of bond pads on the die accessible through the interconnect opening; and

    forming an electrical interconnection between the pattern of bond pads and the pattern of conductors by wire bonding through the interconnect opening.

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