Method and apparatus for crescent boundary thresholding on wire-bonded leads

• US 5,676,302 A
• Filed: 08/31/1995
• Issued: 10/14/1997
• Est. Priority Date: 06/02/1995
• Status: Expired due to Term

• Current Assignee: Cognex Corporation
• Original Assignee: Cognex Corporation
• Inventors: Petry, John P. III
• Primary Examiner(s): Bradley, P. Austin
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US08/520,937
• Time in Patent Office: 775 Days
• Field of Search: 228/104, 228/105, 228/56.5
• US Class Current: 228/104
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: G06T 2207/20068 Projection on vertical or horizontal image axis
• CPC Class Codes: G06T 2207/30152 Solder
• CPC Class Codes: G06T 7/12 Edge-based segmentation
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Method and apparatus for selecting a threshold for use by a boundary tracker to locate a crescent on a bonded lead involves creating a two-dimensional inspection window along the angle of the wire in a post-bond image of a bonded wire in order to generate a one-dimensional projection; generating a one-dimensional projection by summing each column of pixels in the inspection window in the direction of the wire angle and computing an average grey value for each column; and applying an edge-detection to the one-dimensional projection to locate the edges of the wire. If an edge point falls directly in the center of a pixel of the one-dimensional projection, the grey value for that edge point is considered to be the grey value of that pixel. If the edge falls between pixels, the edge'"'"'s grey value is determined by the fractional pixel position of the edge point in the projection. The grey values of the left and right edge points are averaged and used as the threshold value. For more accurate threshold selection or if reflective stripes or confusing edges are likely to occur in the parts being inspected, the same steps are performed using a clipped difference image of the bonded wire instead of a post-bond image.

Claims

1. A method for selecting a threshold value for use by a boundary tracker for locating a crescent in an image of a wire bonded to a lead comprising:

creating a two-dimensional inspection window within said image of said wire bonded to a lead along the angle of the wire, such that said two-dimensional inspection window contains a plurality of rows and columns of pixel values within said image of a wire bonded to a lead;

generating a one-dimensional projection by summing and normalizing each column of said pixel values into a one-dimensional array having a number of bins corresponding to the number of columns in said inspection window;

detecting edges in said one-dimensional projection;

computing pixel values for said threshold from the edges detected in said detecting edges step and providing said pixel values as said threshold to said boundary tracker.

2. The method of claim 1 wherein said image of a wire bonded to a lead is a post-bond image.

3. The method of claim 1 wherein said image of a wire bonded to a lead is a difference image.

4. The method of claim 3 wherein said difference image is clipped so that negative pixel values are eliminated.

5. The method of claim 1, wherein said step of computing pixel values for said threshold further comprises the steps of:

using the pixel values of edges found directly in the center of a pixel in said one-dimensional projection by said edge detecting step; and

averaging grey values of left and right edges to create said pixel values to use in providing said threshold to said boundary tracker.

6. The method of claim 5, wherein said step of computing pixel values for said threshold further comprises the steps of:

calculating the pixel values of edges found between pixels in said one-dimensional projection by said edge detecting step by using the grey values contributed by the fractional pixel positions on either side of said edge in said one-dimensional projection.

7. An apparatus for selecting a threshold value for use by a boundary tracker for locating a crescent in an image of a wire bonded to a lead comprising:

means for creating a two-dimensional inspection window within said image of said wire bonded to a lead along the angle of the wire, such that said two-dimensional inspection window contains a plurality of rows and columns of pixel values within said image of a wire bonded to a lead;

means for generating a one-dimensional projection by summing and normalizing each column of said pixel values into a one-dimensional array having a number of bins corresponding to the number of columns in said inspection window;

means for detecting edges in said one-dimensional projection;

means for computing pixel values for said threshold from the edges detected by said means for detecting edges and providing said pixel values as said threshold to said boundary tracker.

8. The apparatus of claim 7, wherein said means for computing pixel values for said threshold further comprises the steps of:

means for using the pixel values of edges found directly in the center of a pixel in said one-dimensional projection by said edge detecting step; and

means for averaging grey values of left and right edges to create said pixel values to use in providing said threshold to said boundary tracker.

9. The apparatus of claim 8, wherein said means for computing pixel values for said threshold further comprises:

means for calculating the pixel values of edges found between pixels in said one-dimensional projection by said means for detecting edges by using the grey values contributed by the fractional pixel positions on eider side of said edge in said one-dimensional projection.

10. The apparatus of claim 7 wherein said image of a wire bonded to a lead is a post-bond image.

11. The apparatus of claim 10 wherein said image of a wire bonded to a lead is a difference image.

12. The apparatus of claim 11 wherein said difference image is clipped so that negative pixel values are eliminated.