Micromechanical barb and method for making the same

• US 5,676,850 A
• Filed: 06/07/1995
• Issued: 10/14/1997
• Est. Priority Date: 01/31/1991
• Status: Expired due to Term

• Current Assignee: Carnegie Mellon University
• Original Assignee: Carnegie Mellon University
• Inventors: Weiss, Lee E., Reed, Michael L.
• Primary Examiner(s): DANG, THI D
• Application Number:
  US08/484,614
• Time in Patent Office: 860 Days
• Field of Search: 216/2, 216/11, 216/41, 216/46, 216/47, 216/49, 216/51, 216/95, 216/99, 216/100
• US Class Current: 216/2
• CPC Class Codes: A61F 2/82 Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents stent-grafts for tubular structures of the body other than blood vessels A61F2/04; stent-grafts for blood vessels A61F2/07; instruments specially adapted for placement or removal of stents or stent-grafts A61F2/95; for closing wounds, or holding wounds closed A61B17/04 - A61B17/115; dilators A61M29/00
• CPC Class Codes: A61F 2/958 Inflatable balloons for placing stents or stent-grafts
• CPC Class Codes: A61F 2002/8483 Barbs
• CPC Class Codes: A61F 2220/0083 using hook and loop-type fasteners
• CPC Class Codes: A61M 2037/0023 Drug applicators using microneedles
• CPC Class Codes: A61M 2037/003 having a lumen
• CPC Class Codes: A61M 25/104 used for angioplasty
• CPC Class Codes: A61M 37/00 Other apparatus for introducing media into the body for reproduction or fertilisation A61B17/425; apparatus for iontophoresis or cataphoresis A61N1/30; Percutany, i.e. introducing medicines into the body by diffusion through the skin salt baths A61H33/04
• CPC Class Codes: F16B 5/07 by means of multiple interengaging protrusions on the surfaces, e.g. hooks, coils,
• CPC Class Codes: H01L 2224/16105 the bump connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81194 Lateral distribution of the bump connectors
• CPC Class Codes: H01L 2224/81899 using resilient parts in the bump connector or in the bonding area
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: Y10T 24/27 including readily dissociable fastener having numerous, protruding, unitary filaments randomly interlocking with, and simultaneously moving towards, mating structure [e.g., hook-loop type fastener]

Abstract

The present invention pertains to a method for making a plurality of barbs. The method is comprised of the steps of first forming a substrate of a first material with a layer of a second material thereon, and at predetermined discrete locations on the layer a third material. Next, there is the step of removing portions of the layer and the substrate such that a frustrum shape is formed on the surface of the substrate. Next, there is the step of removing the third material but leaving the first and second materials essentially untouched. Then, there is the step of reforming the layer made of the second material on the frustrum surface of the substrate. Next, there is the step of removing portions of the layer at essentially the center of the lowest points of the frustrum. There is then the step of removing portions of the substrate but not the second material such that a plurality of barbs is created.

Claims

1. A method for making a barb comprising the steps of:

forming a substrate of a first material with a layer of a second material thereon, and at a discrete location on the layer a third material;

removing a portion of the layer and the substrate such that a frustum shape is formed on the surface of the substrate;

removing the third material;

reforming the layer made of the second material on the frustum surface of the substrate such that the layer also forms a frustum shape;

removing a portion of the reformed layer outside of the discrete location; and

removing a portion of the substrate such that a barb is created.

2. The method of claim 1, wherein the step of removing a portion of the reformed layer comprises the step of filleting a portion of the second layer to ensure that not too much of the substrate is removed in the step of removing a portion of the substrate.

3. The method of claim 1, wherein the first material comprises silicon.

4. The method of claim 1 wherein the first material comprises steel.

5. The method of claim 1, wherein the second material comprises silicon dioxide.

6. The method of claim 1, wherein the second material comprises photoresist.

7. The method of claim 1, wherein the step of forming a substrate of a first material with a layer of a second material thereon comprises the step of thermally oxidizing the substrate.

8. The method of claim 1, wherein the step of removing a portion of the layer and the substrate comprises the step of anisotropically etching a portion of the layer and the substrate.

9. The method of claim 1, wherein the step of reforming the layer made of the second material comprises the step of thermal oxidation.

10. The method of claim 1, wherein the step of removing a portion of the substrate such that a barb is created comprises the step of isotropically etching a portion of the substrate.