Method for making planar color filter array for image sensors with embedded color filter arrays
First Claim
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1. A method of making a solid state image sensor having a color filter array with color filter elements embedded in a planar top surface, the method comprising the steps of:
- (a) providing a semiconductor substrate having spaced image pixels with at least one transparent layer covering the pixels;
(b) making the transparent layer optically planar by chemical mechanical polishing;
(c) uniformly depositing a second transparent layer of a different material than the first transparent layer;
(d) etching openings into the second transparent layer in regions where first color filter elements are desired to be formed;
(e) conformally depositing a thin protective film in the openings and on a top surface of the second transparent layer;
(f) providing a first color filter layer on the thin protective film which fills the openings in the second transparent layer;
(g) removing the first color filter layer from the top surface of the thin protective film in those regions of the second transparent layer having no openings thereby providing first color filter elements with top surfaces substantially coplanar to the top surface of the second transparent layer; and
(h) repeating the sequence of steps (d), (e), (f) and (g) to form second color filter elements with top surfaces coplanar to the top surface of the second transparent layer.
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Abstract
An image sensor and method of making such sensor is described. The sensor includes an integral color filter array, comprising: a semiconductor substrate having an optically planar top surface; a plurality of spaced image pixels formed in the substrate; and an array of physically contiguous color filter elements embedded in the substrate whose top and bottom surfaces are coplanar and which have no overlap of color filter layers between adjacent color filter elements.
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3 Claims
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1. A method of making a solid state image sensor having a color filter array with color filter elements embedded in a planar top surface, the method comprising the steps of:
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(a) providing a semiconductor substrate having spaced image pixels with at least one transparent layer covering the pixels; (b) making the transparent layer optically planar by chemical mechanical polishing; (c) uniformly depositing a second transparent layer of a different material than the first transparent layer; (d) etching openings into the second transparent layer in regions where first color filter elements are desired to be formed; (e) conformally depositing a thin protective film in the openings and on a top surface of the second transparent layer; (f) providing a first color filter layer on the thin protective film which fills the openings in the second transparent layer; (g) removing the first color filter layer from the top surface of the thin protective film in those regions of the second transparent layer having no openings thereby providing first color filter elements with top surfaces substantially coplanar to the top surface of the second transparent layer; and (h) repeating the sequence of steps (d), (e), (f) and (g) to form second color filter elements with top surfaces coplanar to the top surface of the second transparent layer. - View Dependent Claims (2, 3)
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Specification