Thin IC card

• US 5,677,568 A
• Filed: 12/22/1992
• Issued: 10/14/1997
• Est. Priority Date: 12/26/1991
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Takemura, Seiji, Ochi, Katsunori, Kurisu, Tuguo, Kodai, Syojiro
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): ARROYO, TERESA M
• Application Number:
  US07/994,957
• Time in Patent Office: 1,757 Days
• Field of Search: 257/679, 257/678, 257/687, 235/492, 235/380, 340/146.2, 174/52
• US Class Current: 257/679
• CPC Class Codes: B29L 2017/006 Memory cards, chip cards
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/0706 the battery being replaceable
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01M 50/216 adapted for button or coin cells
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

A thin IC card includes a circuit board on which functional parts are mounted and a through-hole defining an edge of a battery lodging section in which a battery is disposed, the circuit board being embedded in a molding-resin section with the reverse surface of the board exposed. The battery lodging section is aligned with the through-hole of the circuit board. Electrical connections between the circuit board and the battery are effected in a recess or cutouts in the circuit board. The battery is embedded in the lodging section using an expandable resin to make the card surface flat.

Claims

1. A thin IC card having a built-in battery comprising:

a circuit board having obverse and reverse main surfaces, a circuit pattern disposed on the obverse surface of the circuit board, a functional part mounted on the obverse surface of the circuit board and connected to the circuit pattern, and a through-hole in the circuit board including an edge;

a battery;

a unitary molded resin body in which the obverse surface of the circuit board and the functional part are embedded, the reverse surface of the circuit board not being covered by the molded resin body, the molded resin body including a battery lodging recess defined by and accessible through the through-hole in the circuit board and in which the battery is lodged; and

battery connection means firmly supporting the battery in the battery lodging recess and electrically connecting the battery to the circuit pattern on the circuit board.

2. The thin IC card according to claim 1 wherein the battery connection means comprises:

a connection recess at the edge of the through-hole in the circuit board and indented into the molded resin body;

at least a pair of battery-connection electrodes disposed in the connection recess and electrically connected to the circuit pattern on the circuit board; and

at least a pair of battery-connection terminals supporting the battery in the battery lodging recess and electrically connecting the battery to the battery-connection electrodes, the electrodes and the terminals being electrically connected to each other in the connection recess.

3. The thin IC card according to claim 1 wherein the battery connection means comprises:

at least a pair of cutouts in the circuit board at the edge of the through-hole;

at least a pair of battery-connection electrodes electrically connected to the circuit pattern on the circuit board and extending into the cutouts from the obverse surface of the circuit board; and

at least a pair of battery-connection terminals supporting the battery in the battery lodging recess and electrically connecting the battery to the battery-connection electrodes, the electrodes and the terminals being electrically connected to each other in the cutouts.

4. The thin IC card according to claim 3 wherein the battery-connection electrodes are dome-shaped electrodes indented toward the molded resin body covering the cutouts on the obverse surface of the circuit board, the electrodes and the battery-connection terminals being electrically connected to each other in the cutouts.

5. The thin IC card according to claim 1 wherein the battery connection means comprises:

at least a pair of projections of the circuit board extending into the battery lodging recess of the molded resin body contacting the battery; and

battery-connection electrodes on the projections contacting the battery.

6. The thin IC card according to claim 1 wherein a gap between the battery lodging recess and the battery is filled with an expandable resin forming a flat surface flush with the reverse surface of the circuit board.

7. The thin IC card according to claim 1 comprising a sheet bearing a decoration disposed on the reverse surface of the circuit board, the sheet and the molded resin body together forming a planar surface.