Heat-sensitive resistive compound and method for producing it and using it

• US 5,677,662 A
• Filed: 07/12/1996
• Issued: 10/14/1997
• Est. Priority Date: 01/17/1994
• Status: Expired due to Fees

• Current Assignee: Hydor SRL
• Original Assignee: Hydor SRL
• Inventors: Ragazzon, Daniele, Bresolin, Valerio
• Primary Examiner(s): BERHANE, ADOLF D
• Application Number:
  US08/669,561
• Time in Patent Office: 459 Days
• Field of Search: 338/20, 338/22 R, 338/225 D, 338/24, 338/25, 427/58, 419/6, 419/8, 252/511, 128/724
• US Class Current: 338/22.00R
• CPC Class Codes: H01C 1/1406 Terminals or electrodes formed on resistive elements having positive temperature coefficient
• CPC Class Codes: H05B 3/14 the material being non-metallic

Abstract

A heat-sensitive resistive compound is formed by a mixture of particles of at least one electrically conducting material (A) in the solid state and of at least one resin (B) in the solid state; the mixture is dispersed in at least one liquid solvent (C); the percentage by weight of the electrically conducting material (A) with respect to the total weight of the anhydrous compound is 5% to 70%. The resistance of the compound after a furnace process increases, as the temperatures rises, in a substantially linear manner for temperatures that are approximately lower than or equal to 70° C. and in a substantially exponential manner for temperatures that are approximately higher than 70° C. The relative increase in the resistance of the compound with respect to its resistance at ambient temperature is at least 3 for temperatures higher than 100° C. and at least 5 for temperatures above 115° C. The method for providing a PTC device includes the deposition, by printing or screen-printing, of the resistive compound on a flexible or rigid laminar support made of insulating material (2) along an electric path (3) that connects conducting paths (6) which form electrodes; the compound is deposited when cold and is subjected to one or more furnace processes at a temperature that is at least equal to 110° C. for a period and a number of times that are sufficient to achieve the complete evaporation of the solvent (C) and the adhesion of the resin (B) to the substrate.

Claims

1. A method of preparation of a heat-sensitive resistive compound, particularly suitable for PTC devices, comprising the steps of preparing an anhydrous mixture of particles of at least one electrically conducting material (A) in the solid state and of at least one synthetic resin (B) in the solid state, dispersing and homogenizing said anhydrous mixture in a transient carrier (C), wherein the percentage by weight of said electrically conducting material (A) with respect to the total weight of the anhydrous mixture is from 5% to 70%, characterized in that said at least one electrical conducting material (A) comprises particles of a single carbon black of average size approximately in the range from 0.1 μ

m to 100 μ

m, said at least one synthetic resin comprises particles of a polymer or a mixture of polymers selected from among methacrylates and cellulose esters of average size approximately in the range from 20 μ

m to 200 μ

m, said transient carrier (C) being a dispersing agent for said at least one electrically conducting material (A) and being chosen from among liquid solvents of said polymer or polymers.

2. A method according to claim 1, wherein said liquid solvent is chosen from among chlorohydrocarbons, esters and ester-ethers.

3. A method according to claim 1, wherein the percentage of weight of said liquid solvent with respect to the total weight of the compound is in the range from 30% to 80%.

4. A method according to claim 1, wherein one or more metals or metal alloys having a resistivity of less than 0.1 μ

Ω

/m are combined with said single carbon black to form said at least one electrically conducting material (A).

5. A method according to claim 4, wherein said metals are chosen from among nickel, silver, gold, platinum, copper, tin, iron, aluminum, titanium, and tungsten.

6. A method according to claim 4, wherein said electrically conducting material (A) further comprises metallic compounds and metal oxides including TiO and TiB2.

7. A method for manufacturing a PTC element comprising the steps of:

preparing a heat-sensitive resistive compound according to claim 1;

screen printing said heat-sensitive resistive compound at cold on a flexible or rigid laminar support of insulating material to form resistive bands suitable to connect conductive paths defining electrodes; and

heating the screen printed support by one or more furnace processes at a temperature of at least 110°

C. for a sufficient time to achieve full evaporation of the solvent and at least partial adhesion of the resin, wherein the deposition of heat-sensitive resistive compound on the support is adjusted to have bands of average thickness approximately in the range from 5 μ

m to 40 μ

m to provide uniform and highly flexible resistive paths.

8. Method according to claim 7, wherein the resistive bands of heat-sensitive resistive compound are deposited on the conducting paths forming electrodes.

9. Method according to claim 7, wherein the conducting paths forming electrodes are deposited on the bands of heat-sensitive resistive compound.

10. A positive resistance coefficient device or PTC device comprising a flexible or rigid laminar support on which conducting paths defining electrodes and resistive bands of heat-sensitive resistive compound are screen printed and-heated according to the method of claim 7.

11. A device according to claim 10, wherein said resistive bands (3) have an average thickness of approximately 5 μ

m to 40 μ

m.

12. A device according to claim 11, wherein said resistive bands (3) have a resistance at ambient temperature of at least 5 KΩ

/square.