Micromechanical structure with textured surface and method for making same

• US 5,679,436 A
• Filed: 05/22/1995
• Issued: 10/21/1997
• Est. Priority Date: 08/23/1994
• Status: Expired due to Term

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Zhao, Yang
• Primary Examiner(s): WATKINS III, WILLIAM P
• Application Number:
  US08/447,100
• Time in Patent Office: 883 Days
• Field of Search: 428/156, 428/141, 428/137, 73/514.32, 73/514.17, 73/514.36, 361/280
• US Class Current: 428/141
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81C 1/0096 For avoiding stiction when the device is in use, i.e. after manufacture has been completed
• CPC Class Codes: B81C 2201/115 Roughening a surface
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/131 with electrostatic counterbalancing means
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01J 2209/0223 Field emission cathodes
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24479 including variation in thickness

Abstract

A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.

Claims

1. A micromachined device comprising a microstructure suspended above a substrate, said microstructure having a textured surface comprising bumps having diameters less than 0.5 microns, with center-to-center spacings between said bumps greater than the diameters of said bumps.

2. A micromachined device as set forth in claim 1 wherein said bumps have diameters smaller than 0.3 microns.

3. A micromachined device as set forth in claim 1 wherein said bumps have diameters smaller than 0.2 microns.

4. A micromachined device as set forth in claim 2 wherein said microstructure is formed of polysilicon and said substrate is formed of silicon.

5. A micromachined device comprising a microstructure suspended above a substrate, said microstructure having a textured surface comprising bumps having diameters less than 0.5 microns, with center-to-center spacings between said bumps greater than the diameters of said bumps, said device fabricated in accordance with a method comprising the steps of:

(1) depositing a sacrificial layer on a substrate, said layer having a top surface,

(2) depositing a mono-layer of particles of a first size on said surface of said sacrificial layer,

(3) shrinking said particles to a second size smaller than said first size,

(4) depositing a layer of mask material over said sacrificial layer and said particles,

(5) removing said particles such that portions of said mask material overlying said particles are removed while portions not overlying said particles remain on said surface,

(6) etching said sacrificial layer using said mask material as an etch mask so as to form hollows in said surface of said sacrificial layer,

(7) removing said mask material,

(8) removing portions of said sacrificial layer to form holes in said sacrificial layer for formation of anchors for said microstructure;

(9) depositing a microstructure material over said substrate and said sacrificial layer to form said microstructure, said microstructure material filling the holes in said sacrificial layer to form said anchors, and

(10) removing said sacrificial layer, a surface of said microstructure material that was in contact with the top surface of said sacrificial layer before removal of said sacrificial layer having said bumps corresponding to said hollows, wherein a dimension of said bumps is defined by the second size of said particles and a spacing between said bumps is defined by the first size of said particles.

6. A micromachined device comprising a microstructure suspended above a substrate, said microstructure having a textured surface comprising bumps having diameters less than 0.5 microns, with center-to-center spacings between said bumps greater than the diameter of said bumps, said device fabricated in accordance with a method comprising the steps of:

depositing a sacrificial layer on a substrate, said layer having a top surface,

spraying said substrate bearing said sacrificial layer with a solution in which polystyrene spheres of a first size are in suspension,

spinning said substrate about an axis perpendicular to said top surface of said sacrificial layer while in said solution,

removing portions of said sacrificial layer so as to create holes in said sacrificial layer for formation of anchors for said microstructure,

exposing said spheres to oxygen plasma so as to shrink said spheres to a second size smaller than said first size,

depositing a layer of aluminum over said sacrificial layer and said spheres,

immersing said substrate bearing said spheres in a bath that is corrosive to said spheres so as to remove said spheres and a portion of said mask material overlying said spheres,

plasma etching said sacrificial layer using said aluminum as an etch mask so as to form hollows in said top surface of said sacrificial layer,

removing said aluminum by etching,

depositing a microstructure material over said substrate and said sacrificial layer to form said microstructure, said microstructure material filling the holes in said sacrificial layer to form said anchors, and

removing said sacrificial layer, a surface of said microstructure material that was in contact with the top surface of said sacrificial layer before removal of said sacrificial layer having said bumps corresponding to said hollows, wherein a dimension of said bumps is defined by the second size of said spheres and a spacing between said bumps is defined by the first size of said spheres.