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Conductive encapsulating shield for an integrated circuit

  • US 5,679,975 A
  • Filed: 12/18/1995
  • Issued: 10/21/1997
  • Est. Priority Date: 12/18/1995
  • Status: Expired due to Fees
First Claim
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1. A packaged integrated circuit comprising:

  • an integrated circuit die comprising bond pads;

    a plurality of leads extending away from the integrated circuit die;

    means for connecting the bond pads to the leads;

    an insulative member encapsulating the integrated circuit die, the means for connecting, and an inner portion of the leads, the insulative member having an outer surface including a first portion located above the leads and a second portion located above the integrated circuit die; and

    a conductive shield attached to the outer surface of the insulative member wherein the conductive shield covers only the first portion of the outer surface of the insulative member.

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