Method of fabricating a multilayer ceramic capacitor

• US 5,680,685 A
• Filed: 06/07/1995
• Issued: 10/28/1997
• Est. Priority Date: 06/07/1995
• Status: Expired due to Fees

• Current Assignee: Microelectronics Packaging, Inc.
• Original Assignee: Microelectronics Packaging, Inc.
• Inventors: Bischoff, William P.
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Nguyen, Khan
• Application Number:
  US08/474,488
• Time in Patent Office: 874 Days
• Field of Search: 29/25.42, 29/851, 29/830, 29/25.41, 361/321.4, 361/321.5, 501/134, 501/135, 501/136, 264/61, 264/66, 264/345, 156/89, 156/228, 156/242
• US Class Current: 29/25.42
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49163 with sintering of base

Abstract

A method of fabricating a large, rectangular, multilayer ceramic capacitor formed of alternating ceramic and electrode layers. Capacitors so formed have a high dielectric constant, extremely low leakage current and an extremely low dissipation factor. Exemplary capacitors can be made with a lead magnesium niobate dielectric composition powder to which is added several organic constituents, including a surfactant and a plasticizer, plus small amounts of several dopants, such as lithium niobate, copper oxide, magnesium titanate, manganese niobate and zirconium oxide. That total mixture is ball milled to form a slip with very small grain size. The slip is cast as a thin tape on a Mylar backing, cut into a plurality of blanks, and alternating layers of the green tape ceramic and electrode layers are laminated on a polyvinyl alcohol coated foundation plate. Firing and sintering steps are followed by application of electrical terminations to complete the capacitor. The final package is annealed to further improve the dielectric constant and the dissipation factor.

Claims

1. A method of making a multilayer ceramic capacitor comprising the steps of:

selecting a dielectric composition powder as a base material;

adding predetermined amounts of organic materials functioning as liquifiers, binders and plasticizers, the organic materials being easily evaporated and sublimed substantially below the sintering temperature, and adding selected dopants in powder form in predetermined amounts;

ball milling the combination of dielectric composition, dopants and organic materials to form a fully dispersed colloidal suspension slip and for a sufficient time to reduce the composition to particles having a predetermined size range;

casting the slip on a sheet of polyester film in tape form at an elevated temperature to evaporate a significant portion of the organics added to the dielectric composition powder, thereby forming a green tape;

forming a multilayer capacitor laminate green capacitor body of alternate layers of ceramic blanks formed from the green tape and electrodes by lamination under pressure, the electrodes as applied to the ceramic blanks being perforated within multiplicity of holes through which ceramic material passes during the laminating process;

completing removal of the organics by subjecting the green capacitor body to predetermined temperatures for predetermined periods of time according to a first schedule to form a partially cured capacitor;

sintering the partially cured capacitor at further predetermined temperatures for predetermined periods of time according to a second schedule; and

adding terminations to make selective electrical connection with the electrodes in the ceramic capacitor.

2. The method recited in claim 1, wherein the second schedule includes the step of annealing the sintered capacitor to remove excess base body material from the grain boundary.

3. The process recited in claim 1, and comprising the further step of abrading opposite edges of the sintered capacitor to expose alternating electrodes on each edge for connection to the electrical terminations.

4. The method recited in claim 1, wherein said forming step comprises:

cutting the green tape and polyester film to predetermined equal size blanks with the polyester film remaining thereon;

moving each blank to place it on top of each prior blank;

removing the polyester film from the last-placed ceramic blank;

laminating together a first plurality of said blanks to form a top inactive cover element and laminating together a second plurality of said blanks to form a bottom inactive cover element;

alternately printing an electrode on one side of one of said bottom cover element and laminating thereon another of said blanks followed by additional printing and laminating steps; and

laminating said top cover element to the top of the last electrode layer on the capacitor laminate.

5. The method recited in claim 1, wherein the electrode layers are screen printed through a 400 mesh stainless steel screen onto a green tape ceramic blank to form a sheet about 0.0002 to 0.00056 inch thick having a plurality of holes therethrough occupying about 8-8.5% of the surface area of each electrode layer, the electrode leaving a margin on one side of the ceramic blank, each succeeding electrode leaving a margin on opposite sides of the ceramic blanks, the ceramic material forced through the holes in the electrodes during the lamination process form bonds between adjacent ceramic blanks separated by an electrode.

6. The method recited in claim 1, wherein capacitors so formed range in surface size of about 0.5 inch square to about three by four inches on a side and having active layers numbering between 5 and 100.

7. The method recited in claim 1, and further comprising the step of sintering the terminations at about 725°

C. for about 11 minutes.

8. The method recited in claim 1, wherein each said ceramic layer is between about 0.0005 and 0.005 inch thick and each said electrode layer is between about 0.0002 and 0.00056 inch thick.

9. The method recited in claim 1, wherein a plurality of said ceramic blanks are laminated together on each outside face of said capacitor to function as cover elements therefor.

10. The method recited in claim 1, wherein the particles are reduced in the ball milling step to no more than about 0.04 μ

m in diameter with normal three sigma distribution and the polyester tape has a thickness ranging between about 0.0005 to 0.005 inch.

11. A method of making a multilayer ceramic capacitor comprising the steps of:

selecting a dielectric composition powder as a base material;

adding predetermined amounts of organic materials functioning as liquifiers, binders and plasticizers, the organic materials being easily evaporated and sublimed substantially below the sintering temperature, and adding selected dopants in powder form in predetermined amounts;

ball milling the combination of dielectric composition, dopants and organic materials to form a fully dispersed colloidal suspension slip and for a sufficient time to reduce the composition to particles a predetermined size range;

casting the slip on a sheet of polyester film at an elevated temperature to evaporate a significant portion of the organics added to the dielectric composition powder, thereby forming a green tape;

forming a multilayer green capacitor body of alternate layers of green tape and electrodes by lamination under pressure;

completing removal of the organics by subjecting the green capacitor body to predetermined temperatures for predetermined periods of time according to a first schedule to form a partially cured capacitor, the first schedule comprising the steps of;

placing the green capacitor body in an oven;

then

ramping up the temperature in the oven at about 0.5°

to 2.0°

C. per minute to a level of about 295°

to 310°

C.;

maintaining the oven temperature at about 295°

to 310°

C. for about 36 hours;

then ramping up the temperature in the oven at about 400°

to 500°

C.;

maintaining the oven temperature at about 400°

to 500°

C. for about 24 hours; and

then

ramping the oven temperature down to room temperature at about 30°

C. per minute;

sintering the partially cured capacitor at further predetermined temperatures for predetermined periods of time according to a second schedule; and

adding terminations to make selective electrical connection with the electrodes in the ceramic capacitor.

12. A method of making a multilayer ceramic capacitor comprising the steps of:

selecting a dielectric composition powder as a base material;

adding predetermined amounts of organic materials functioning as liquifiers, binders and plasticizers, the organic materials being easily evaporated and sublimed substantially below the sintering temperature, and adding selected dopants in powder form in predetermined amounts;

ball milling the combination of dielectric composition, dopants and organic materials to form a fully dispersed colloidal suspension slip and for a sufficient time to reduce the composition to particles having a predetermined size range;

casting the slip on a sheet of polyester film in tape form at an elevated temperature to evaporate a significant portion of the organics added to the dielectric composition powder, thereby forming a green tape;

forming a multilayer green capacitor body of alternate layers of green tape and electrodes by lamination under pressure;

completing removal of the organics by subjecting the green capacitor body to predetermined temperatures for predetermined periods of time according to a first schedule to form a partially cured capacitor;

sintering the partially cured capacitor at further predetermined temperatures for predetermined periods of time according to a second schedule, the second schedule comprising the steps of;

placing the partially cured capacitor in a kiln;

then

ramping up the temperature in the kiln at about 10°

-30°

C. per minute to a level of about 940°

-960°

C.;

maintaining the kiln temperature at about 940°

-960°

C. for about 40-80 minutes;

then

ramping down the kiln temperature at about 10°

-40°

C. per minute to a level of about 700°

-800°

C.;

annealing the sintered capacitor by maintaining the kiln temperature at about 700°

-800°

C. for about 100-140 minutes; and

then

turning off the kiln and allowing it to cool; and

adding terminations to make selective electrical connection with the electrodes in the ceramic capacitor.