Method and apparatus for producing a plastic molded chip card having reduced wall thickness

• US 5,681,356 A
• Filed: 04/05/1994
• Issued: 10/28/1997
• Est. Priority Date: 05/10/1991
• Status: Expired due to Fees

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Haghiri-Tehrani, Yahya, Barak, Renee-Lucia, Baader, Helmut
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US08/146,087
• Time in Patent Office: 1,302 Days
• Field of Search: 437/214, 29/25.01, 264/328.7, 264/272.17
• US Class Current: 29/25.01
• CPC Class Codes: B29C 2045/569 using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
• CPC Class Codes: B29C 45/14024 and punching or cutting a portion from the endless articles during mould closing
• CPC Class Codes: B29C 45/14647 Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
• CPC Class Codes: B29C 45/56 using mould parts movable during or after injection, e.g. injection-compression moulding B29C45/1705 and B29C45/572 take precedence
• CPC Class Codes: B29L 2017/006 Memory cards, chip cards
• CPC Class Codes: G06K 19/07724 the record carrier being at least partially made by a molding process molding in general B29C45/14
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus and method for producing plastic chip cards and chip card blanks with a wall thickness considerably reduced in certain areas involves first injecting the plastic material into an initial mold space that has no reductions in wall thickness as yet. The distance between certain wall areas of the initial mold space is then reduced to the required reduced measure, displacing the plastic material into adjacent areas of the mold space.

Claims

1. A method for producing chip cards comprising an injection-molded plastic card body with a recess containing a chip module, comprising the following steps:

positioning a foil strip carrying chip modules in front of and adjacent the face of a movable die of an injection mold apparatus;

drawing the foil strip and an associated chip module against the face of the die by activating a suction air source associated with the die;

advancing the die toward an initial mold space defined by mold wall areas whose configuration corresponds substantially to the card body without the recess, and simultaneously stamping a chip module out of the foil strip by the die so that the stamped chip module is affixed to the die face by the air suction;

positioning the chip module by means of the die movement at the area of a boundary surface of the initial mold space;

injecting molten plastic material into the initial mold space to form the card body;

further advancing the die so that the chip module on the die face is pressed into a surface of the injected plastic material after the mold space in the area of the die is substantially filled with plastic material;

completely filling the mold space insofar as any cavities in the mold space are left to be filled with plastic material;

cooling the plastic material until the plastic material has solidified; and

opening the mold apparatus and removing the card body and chip module.

3. The method of claim 1 or 2, wherein the movable die is advanced into the initial mold space only after the latter has been filled virtually completely with plastic material.

4. The method of claim 3 wherein wall distances defining the initial mold space are increased in certain areas of the mold space while the movable die is advanced to reduce the mold space in the area of the recess, the area where the wall distances increase being arranged to receive plastic material displaced out of the mold space in areas that are reduced.

5. The method of claim 4 wherein the plastic material is displaced into a gate system for the mold when the die is advanced into the initial mold space.

6. The method of claim 1 or 2, wherein the plastic material displaced by advancement of the movable die into the initial mold space is accommodated during the injection of molten plastic material into the mold space.

7. The method of any one of claim 1 or 2, wherein the chip module has a hot-melt adhesive coating, including the step of activating the coating by the residual heat of the molded plastic material after the chip module has been placed in the recess.

8. A method according to claim 1 or 2, wherein the chip cards comprise mini-chip cards integrated in a standard card that is connected via links with the surrounding card body of the standard card, including the step of producing the outer shade of the mini-chip card by pressing a stamping die into a plastic material disposed in the initial mold space.

2. A method for producing chip cards comprising an injection-molded plastic card body with a recess containing a chip module, comprising the following steps:

advancing a movable die of an injection mold apparatus and having a variable configuration face conforming to a chip module receiving recess to be produced in a chip card into a boundary area of an initial mold space defined by mold wall areas whose configuration corresponds substantially to the card body without the recess;

injecting molten plastic material into the initial mold space;

further advancing the die into the plastic material in the mold space to form a recess in the injected plastic material;

further injecting the plastic material into the mold space until the mold space is filled to form the card body;

cooling the plastic material until it has solidified;

withdrawing the movable die to a waiting position at which a foil strip carrying chip modules may be positioned in front of and adjacent the face of the die;

changing the face of the die into a form suitable for stamping out a chip module, fixing the stamped chip module to the die face, and inserting the chip module into the recess in the plastic material;

positioning a foil strip carrying chip modules in front of and adjacent the die face;

drawing to and affixing the chip module against the face of the die;

advancing the die again while stamping out a chip module from the foil strip until the chip module is inserted and pressed into the recess in the molded plastic material; and

opening the mold apparatus and removing the card body with the chip module in the recess.

9. An injection molding apparatus for producing plastic chip cards with chip modules in recesses in the cards, the molding apparatus comprising:

a mold space defined at least in part by mold wall areas and at least one die having a virtually flat die face movable between first and second positions within and outside of the mold space, respectively;

said mold space corresponding virtually to the shape of a chip card without recess;

said mold apparatus including guide means for guiding a foil strip carrying chip modules in front of and adjacent said die face.

10. An injection molding apparatus for producing chip cards, the molding apparatus comprising mold wall areas enclosing at least one mold space and at least one die movable between first and second positions within and outside of the mold space, respectively;

said mold space corresponding virtually to the shape of a chip card without a recess;

said mold apparatus including a guide means for a foil strip carrying chip modules;

said die face having a configuration that is variable between a configuration that corresponds with the configuration of a recess to be formed in plastic material injected into the mold space or a configuration that is virtually flat.

11. A method for producing chip cards comprising an injection-molded plastic card body with a recess having a membrane bottom, said recess arranged to receive a chip module, comprising the following steps:

producing a card body by injecting a molten plastic material into an initial mold space defined by mold wall areas of an injection mold apparatus and whose configuration corresponds substantially to the card body without the recess, the card body having outer dimensions of about 85 mm×

54 mm and a thickness of about 0.76 mm;

reducing the distance between certain wall areas of the initial mold space by advancing a movable die into the mold space to form a recess in the plastic material after the plastic material has flowed at least into the area of the movable die and only after the initial mold space has been filled virtually completely with plastic material so as to leave a membrane bottom of plastic material having a thickness between 80 μ

m and 150 μ

m, whereby the plastic material in the area of the recess is compressed and/or displaced out of said area, and wherein wall distances defining the initial mold space are increased in certain areas of mold space while the movable die is advanced to reduce the mold space in the area of the recess, the area where the wall distances increase being arranged to receive plastic material displaced out of the mold space in areas that are reduced;

withdrawing the die from the mold space and removing the card body with the formed recess from the mold space; and

fastening a chip module in the recess.

12. The method of claim 11 wherein the plastic material is displaced into a gate system for the mold when the die is advanced into the initial mold space.

13. A method for producing chip cards comprising an injection-molded plastic card body with a recess having a membrane bottom, said recess arranged to receive a chip module, comprising the following steps:

producing a card body by injecting a molten plastic material into an initial mold space defined by mold wall areas of an injection mold apparatus and whose configuration corresponds substantially to the card body without the recess, the card body having outer dimensions of about 85 mm×

54 mm and a thickness of about 0.76 mm;

reducing the distance between certain wall areas of the initial mold space by advancing a movable die into the mold space to form a recess in the plastic material after the plastic material has flowed at least into the area of the movable die so as to leave a membrane bottom of plastic material having a thickness between 80 μ

m and 150 μ

m, whereby the plastic material in the area of the recess is compressed and/or displaced out of said area;

withdrawing the die from the mold space and removing the card body with the formed recess from the mold space;

fastening a chip module in the recess;

wherein the chip module has a hot-melt adhesive coating, including the step of activating the coating by the residual heat of the molded plastic material after the chip module has been placed in the recess.