Semiconductor device incorporating a temperature fuse
First Claim
1. A semiconductor device comprising:
- a semiconductor chip including at least one semiconductor element and at least one semiconductor element and at least two surface electrodes;
at least two lead terminals one of which is electrically connected to a first one of the surface electrodes;
a temperature fuse element provided adjacent to the semiconductor element, the temperature fuse element including a patterned flat conductor strip formed on a flat insulating surface to be melt-cut at a predetermined temperature, one end of the patterned conductor strip being electrically connected to a second one of the surface electrodes, the other end of the patterned conductor strip being electrically connected to another of the lead terminals; and
a package separate from the insulating surface for commonly enclosing the semiconductor chip, the fuse element, and part of the lead terminals.
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Accused Products
Abstract
A semiconductor device is provided which comprises a semiconductor chip including at least one semiconductor element and at least two surface electrodes, at least two lead terminals one of which is electrically connected to a first one of the surface electrodes, a temperature fuse element provided adjacent to the semiconductor element, and a package commonly enclosing the semiconductor chip, the fuse element, and part of the lead terminals. The temperature fuse element includes a patterned conductor strip formed on an insulating surface to be melt-cut at a predetermined temperature. One end of the patterned conductor strip is electrically connected to a second one of the surface electrodes, whereas the other end of the patterned conductor strip is electrically connected to another of the lead terminals.
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Citations
13 Claims
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1. A semiconductor device comprising:
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a semiconductor chip including at least one semiconductor element and at least one semiconductor element and at least two surface electrodes; at least two lead terminals one of which is electrically connected to a first one of the surface electrodes; a temperature fuse element provided adjacent to the semiconductor element, the temperature fuse element including a patterned flat conductor strip formed on a flat insulating surface to be melt-cut at a predetermined temperature, one end of the patterned conductor strip being electrically connected to a second one of the surface electrodes, the other end of the patterned conductor strip being electrically connected to another of the lead terminals; and a package separate from the insulating surface for commonly enclosing the semiconductor chip, the fuse element, and part of the lead terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification