Apparatus for manufacturing resonant tag

• US 5,682,814 A
• Filed: 08/22/1995
• Issued: 11/04/1997
• Est. Priority Date: 08/06/1990
• Status: Expired due to Fees

• Current Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Original Assignee: Tokyo Electron Limited
• Inventors: Suzuki, Yuji, Matsumoto, Takeshi, Imaichi, Hideaki, Haneda, Tadayoshi, Himura, Koichi
• Primary Examiner(s): GERRITY, STEPHEN FRANCIS
• Application Number:
  US08/517,687
• Time in Patent Office: 805 Days
• Field of Search: 100/93 P, 100/315, 100/319-321, 100/326
• US Class Current: 100/315
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G01S 13/753 using frequency selective elements, e.g. resonator
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: H03H 3/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
• CPC Class Codes: H03H 5/003 comprising distributed impedance elements together with lumped impedance elements
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes parallel traces in one plane H05K2201/09236
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31909 : Next to second addition polymer from unsaturated monomers

Abstract

A resonant tag is manufactured in the manner described below: a conductive thin film is formed to a predetermined thickness on two surfaces of an insulating thin film. Thereafter, a conductive pattern, composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit, is printed on a surface of one of the conductive thin films, and a conductive pattern, composed of a capacitor element corresponding to the resonant frequency of the resonant circuit, is printed on a surface of the other insulating thin film at a position which faces the capacitor element formed on one of the conductive thin films using an ink which resists etching. A non-printed portion of the conductive thin films is removed by etching to form a resonant circuit pattern. Thereafter, a portion of the insulating thin film, which corresponds to the capacitor element pattern, is thinned to a desired thickness by pressing a heating/pressing member heated to a predetermined temperature against that portion under a predetermined pressure for a predetermined period of time.

Claims

1. An apparatus for manufacturing a resonant tag having a resonant circuit including capacitor electrodes formed at opposing positions on the two surfaces of a substantially flat insulating material, and an inductor element, one of said capacitor electrodes extending beyond the opposing electrode said apparatus for manufacturing a resonant tag comprising:

heat press means for pressing said insulating material from the side of the larger electrode to adjust the tuning frequency of said resonant circuit by thinning out the thickness of the pressed portion of the insulating material; and

a base, having a surface larger than said heat press means, for receiving the pressure of the heat press means; and

wherein the base comprises at least a first layer and a second layer, the first layer being formed of a sheet material having a rigidity greater than that of the second layer.

2. An apparatus for manufacturing a resonant tag according to claim 1, wherein said first layer comprises a metal material and said second layer comprises a material made of a resin.

3. An apparatus for manufacturing a resonant tag according to claim 1, wherein said heat press means for pressing has a pressing portion of a generally flat surface area with edges along an outer periphery, the surface area generally corresponding to a surface area of the smaller electrode, the edges along the outer periphery of the pressing portion being rounded.