Microstrip EMI shunt for an implantable medical device

• US 5,683,434 A
• Filed: 12/06/1996
• Issued: 11/04/1997
• Est. Priority Date: 12/06/1996
• Status: Expired due to Term

• Current Assignee: Pacesetter Incorporated (Abbott Laboratories)
• Original Assignee: Pacesetter Incorporated (Abbott Laboratories)
• Inventors: Archer, Stephen Thomas
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): EVANISKO, GEORGE ROBERT
• Application Number:
  US08/759,652
• Time in Patent Office: 333 Days
• Field of Search: 607/2, 607/9, 607/36-38, 607/63, 128/901, 128/908, 333/12, 333/182, 333/204
• US Class Current: 607/36
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01Q 13/206 Microstrip transmission line antennas

Abstract

A microstrip EMI shunt for an implantable medical device (e.g., an ICD) which includes a microstrip transmission line secured to an interior surface of a housing of the device, the microstrip transmission line having a first end secured to a connector wire which is electrically coupled to internal electronics of the device, and a second end which is open-circuited. The microstrip transmission line has a length nλ/4, where λ is the wavelength of EMI (in the microstrip medium) having a selected frequency f which is desired to be shunted, and n is an odd integer ≧1. In operation, EMI of the frequency f is shunted via the microstrip transmission line prior to reaching the internal electronics of the device. Additional microstrip transmission lines having appropriately chosen lengths to shunt EMI of different frequencies can also be provided.

Claims

1. A microstrip EMI shunt device for an implantable medical device which includes a housing, internal electronics contained within the housing, and a connector wire, the microstrip EMI shunt comprising:

a microstrip transmission line positioned in the housing, said microstrip transmission line having a first end electrically coupled to the connector wire and a second end which is open-circuited, wherein said connector wire is electrically coupled to said internal electronics;

wherein said microstrip transmission line has a length which is nλ

/4, where λ

represents the wavelength of EMI having a selected frequency f, and n is an odd integer >

1; and

,

wherein said microstrip transmission line presents a low impedance to EMI having the frequency f, so that EMI of the selected frequency f is shunted prior to reaching the internal electronics of the implantable medical device.

2. The microstrip EMI shunt device as set forth in claim 1, wherein said housing is metallic and said microstrip transmission line is secured to an interior surface of the housing.

3. The microstrip EMI shunt device as set forth in claim 1, wherein the implantable medical device comprises an implantable cardiac stimulation device.

4. The microstrip EMI shunt device as set forth in claim 1, wherein the implantable cardiac stimulation device comprises an implantable cardioverter-defibrillator.

5. The microstrip EMI shunt device as set forth in claim 1, wherein said microstrip transmission line is comprised of an electrically conductive layer sandwiched between first and second electrically insulating layers.

6. The microstrip EMI shunt device as set forth in claim 5, wherein said electrically conductive layer is comprised of metal foil.

7. The microstrip EMI shunt device as set forth in claim 6, wherein each of said first and second electrically insulating layers is made of polyimide.

8. The microstrip EMI shunt device as set forth in claim 5, wherein each of said first and second electrically insulating layers is made of polyimide.

9. The microstrip EMI shunt device as set forth in claim 5, wherein said microstrip transmission line is laid flat on an interior surface of the housing and adhesively secured thereto.

10. The microstrip EMI shunt device as set forth in claim 1, wherein the implantable medical device further includes additional connector wires, and the microstrip EMI shunt device further comprises additional microstrip transmission lines each positioned in the housing, each of said additional microstrip transmission lines having a first end electrically coupled to a respective one of the additional connector wires, and a second end which is open-circuited, wherein each said connector wire is electrically coupled to said internal electronics.

11. The microstrip EMI shunt device as set forth in claim 10, wherein said additional microstrip transmission lines are secured to an interior surface of the housing.

12. The microstrip EMI shunt device as set forth in claim 10, wherein each of said additional microstrip transmission lines has a length which is nλ

/4.

13. The microstrip EMI shunt device as set forth in claim 1, further comprising additional microstrip transmission lines each having a first end electrically coupled to the connector wire, and a second end which is open-circuited.

14. The microstrip EMI shunt device as set forth in claim 13, wherein each of said additional microstrip transmission lines has a different length.

15. The microstrip EMI shunt device as set forth in claim 13, wherein each of said additional microstrip transmission lines has a length appropriate to shunt EMI of a different respective frequency.

16. The microstrip EMI shunt device as set forth in claim 1, wherein the selected frequency f is equal to v/λ

, where v represents the speed of the EMI in said microstrip transmission line.

17. The microstrip EMI shunt device as set forth in claim 1, wherein said housing is metallic and said microstrip transmission line is carried on a flex circuit with at least a major portion of said transmission line positioned substantially parallel to a wall of said housing.