Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly
First Claim
1. A method of electrical connection to electronic circuits inside a hermetically sealed housing of an implantable medical device to connector blocks of a connector assembly disposed outside of the hermetically sealed housing, the method comprising the steps of:
- forming a hollow weld ring dimensioned to be received in an aperture of a wall of the hermetically sealed housing;
forming a multilayered structure of insulating layers with printed conductors therebetween, the printed conductors extending between a first portion and an opposite second of the multilayered structure portion and terminating in a first plurality of connector pads at the first portion for connection to the connector block and in a second plurality of connector pads at the second portion for connection to the electronic circuits;
disposing the hollow weld ring over the multilayered structure so as to have the first portion residing within the connector assembly and the second portion residing within the hermetically sealed housing;
brazing the hollow weld ring onto a portion of an outer surface of the multilayered structure;
forming a housing with an aperture dimensioned to fit about the weld ring; and
welding the hollow weld ring to the housing so that the electronic circuits are hermetically sealed within the housing.
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Accused Products
Abstract
A wireless feedthrough assembly, for coupling leads received in the receptacles of a connector assembly to the electronic circuit within a cardiac pacemaker, includes a weld ring mounted in hermetically sealed fashion within a housing wall of the pacemaker and itself hermetically sealed to an intermediate portion of an elongated, multilayered structure. The multilayered structure includes layers of electrically insulating ceramic material on opposite sides of a planar array of printed conductors extending between a first portion of the structure within the connector assembly and an opposite second portion of the structure within the pacemaker. Connector pads at the ends of the printed conductors within the first portion are coupled to the receptacles of the connector assembly, while contact pads at the exterior of the second portion and coupled by vias to connector pads at the ends of the printed conductors are coupled to the electronic circuits within the pacemaker. Printed ground planes on the multilayered structure form a conductive envelope which shields the printed conductors from electric fields. The contact pads include positive and ground contacts to which are coupled discrete filtering capacitors for limiting the spectrum of frequencies receivable by the connector assembly. A method for making the aforedescribed feedthrough assembly.
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Citations
3 Claims
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1. A method of electrical connection to electronic circuits inside a hermetically sealed housing of an implantable medical device to connector blocks of a connector assembly disposed outside of the hermetically sealed housing, the method comprising the steps of:
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forming a hollow weld ring dimensioned to be received in an aperture of a wall of the hermetically sealed housing; forming a multilayered structure of insulating layers with printed conductors therebetween, the printed conductors extending between a first portion and an opposite second of the multilayered structure portion and terminating in a first plurality of connector pads at the first portion for connection to the connector block and in a second plurality of connector pads at the second portion for connection to the electronic circuits; disposing the hollow weld ring over the multilayered structure so as to have the first portion residing within the connector assembly and the second portion residing within the hermetically sealed housing; brazing the hollow weld ring onto a portion of an outer surface of the multilayered structure; forming a housing with an aperture dimensioned to fit about the weld ring; and welding the hollow weld ring to the housing so that the electronic circuits are hermetically sealed within the housing. - View Dependent Claims (2, 3)
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Specification