Inductively coupled plasma reactor and process

• US 5,683,548 A
• Filed: 02/22/1996
• Issued: 11/04/1997
• Est. Priority Date: 02/22/1996
• Status: Expired due to Term

• Current Assignee: SPTS Technologies Limited (KLA Corporation)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Arnold, John C., Hartig, Michael J.
• Primary Examiner(s): DANG, THI D
• Application Number:
  US08/605,697
• Time in Patent Office: 621 Days
• Field of Search: 156/345, 156/643.1, 218/68, 118/723 I, 118/723 IR, 118/723 R, 427/569
• US Class Current: 438/729
• CPC Class Codes: C23C 16/507 using external electrodes, e.g. in tunnel type reactors
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: Y10S 438/935 Gas flow control

Abstract

An inductively coupled plasma reactor and method for processing a semiconductor wafer (28). The inductively coupled plasma reactor (10) includes a plasma source (16) having a plurality of channels (38, 44) in which processing gases are independently supplied to each channel. A gas supply system (20) includes a plurality of gas feed lines (34, 35, 36) each capable of supplying an individual flow rate and gas composition to the plurality of channels (38, 44) in the plasma source (16). Each channel is surrounded by an independently powered RF coil (54, 56), such that the plasma density can be varied within each channel (38, 44) of the plasma source (16). In operation, a material layer (66) overlying a semiconductor wafer (28) is either uniformly etched or deposited by localized spatial control of the plasma characteristics at each location (64) across the semiconductor wafer (28).

Claims

1. A process for fabricating a semiconductor device comprising the steps of:

providing a coaxial multiple coil inductive coupled plasma reactor having;

a reaction chamber;

a chuck positioned in the reaction chamber and configured for accepting and supporting a semiconductor wafer on a surface thereof;

a plasma source mounted within the reaction chamber in spaced relationship with the chuck, the plasma source including a plurality of channels, each channel having a gas orifice opening thereto, a gas plenum, and an RF coil surrounding the channel,

wherein each gas orifice provides a passage between the channel and the gas plenum and the plurality of channels are arranged concentrically about a central axis perpendicular to the surface of the chuck;

independent gas supply lines attached to each gas orifice; and

a gas control system capable of independently charging each gas supply line with a plasma-forming gas, such that a gas composition and a gas flow rate of the plasma-forming gas in each gas supply line can be independently varied;

placing a semiconductor wafer on the chuck, the semiconductor wafer having a material layer to be etched;

actuating the gas control system to charge the plasma reactor with plasma-forming gas;

applying RF power to the RF coils and igniting a plasma in the reaction chamber;

etching the material layer,

wherein the etching is characterized by an etching uniformity; and

controlling the etching uniformity by adjusting the gas flow rate and the gas composition.

2. The process of claim 1, further comprising applying RF power to the chuck to provide an RF bias voltage between the semiconductor wafer and the plasma.

3. A process for fabricating a semiconductor device comprising the steps of:

providing a semiconductor wafer characterized by a radius and a perimeter, the semiconductor wafer having a surface,

wherein the surface is characterized by a plurality of locations on the surface, each location specified by a radial distance varying from zero to the radial distance of the perimeter of the semiconductor wafer;

forming a material layer on the surface;

placing the semiconductor wafer in an inductively coupled plasma reactor, the plasma reactor having a plasma source including a plurality of concentric channels therein,

wherein each channel is independently powered by an RF coil surrounding the channel;

introducing reactive gas to each channel,

wherein the reactive gas is characterized by a gas flow rate and a gas composition

supplying RF power to each RF coil to produce an RF power density in each channel; and

etching the material layer, while controlling the etch rate of the material layer at each location on the semiconductor wafer by independently varying the gas flow rate and gas composition of the reactive gas and the RF power density.

4. The process of claim 3, wherein the material layer is a semiconductor material and the reactive gas comprises at least one species selected from the group consisting of a halogen and a halogenated compound.

5. The process of claim 3, wherein the material layer is a conductive material and the reactive gas comprises at least one species selected from the group consisting of chlorine and a chlorinated compound.

6. The process of claim 3, wherein the material layer is a dielectric material and the reactive gas comprises at least one species selected from the group consisting of fluorine and a fluorinated compound.

7. A process for fabricating a semiconductor device comprising the steps of:

providing a coaxial multiple coil inductive coupled plasma reactor having;

a reaction chamber;

a chuck positioned in the reaction chamber and configured for accepting and supporting a semiconductor wafer on a surface thereof;

a plasma source molted within the reaction chamber in spaced relationship with the chuck, the plasma source including a plurality of channels, each channel having a gas orifice opening thereto, a gas plenum, and an RF coil surrounding the channel,

wherein each gas orifice provides a passage between the channel and the gas plenum and the plurality of channels are arranged concentrically about a central axis perpendicular to the surface of the chuck;

independent gas supply lines attached to each gas orifice; and

a gas control system capable of independently charging each gas supply line with a plasma-forming gas, such that a gas composition and a flow rate of the plasma-forming gas in each gas supply line can be independently varied;

placing a semiconductor wafer on the chuck;

actuating the gas control system to charge the plasma reactor with plasma-forming gas;

applying RF power to the RF coils and igniting a plasma in the reaction chamber;

depositing a material layer onto the semiconductor wafer, wherein the deposition is characterized by a deposition uniformity; and

controlling the deposition uniformity by adjusting the gas flow rate and the gas composition emerging from the plurality of channels and by controlling the RF power density in each channel.

8. A process for fabricating a semiconductor device comprising the steps of:

providing a semiconductor wafer characterized by a radius and a perimeter, the semiconductor wafer having a surface,

wherein the surface is characterized by a plurality of locations on the surface, each location specified by a radial distance varying from zero to the radial distance of the perimeter of the semiconductor wafer;

placing the semiconductor wafer in an inductively coupled plasma reactor, the plasma reactor having a plasma source including a plurality of concentric channels therein,

wherein each channel is independently powered by an RF coil surrounding the channel;

introducing reactive gas to each channel,

wherein the reactive gas is characterized by a gas flow rate and gas composition

supplying RF power to each RF coil to produce an RF power density in each channel; and

processing the semiconductor wafer, while controlling the plasma conditions at each location on the semiconductor wafer by independently varying the gas flow rate and gas composition of the reactive gas and the RF power density in each channel.

9. The process of claim 8, wherein the step of processing the semiconductor wafer comprises etching a material layer overlying the semiconductor wafer.

10. The process of claim 8, wherein the step of processing the semiconductor wafer comprises depositing a material layer onto the semiconductor wafer.

11. A process for fabricating a semiconductor device comprising the steps of:

providing a plasma reactor, the plasma reactor having a first plasma generation region and a second plasma generation region, the first plasma generation region having a perimeter wherein the second plasma generation region surrounds the perimeter of the first plasma generation region;

placing a semiconductor substrate within the plasma reactor;

using the first plasma generation region and the second plasma generation region to generate a plasma within the plasma reactor; and

processing the semiconductor substrate in the plasma reactor using the plasma.

12. The process of claim 11, wherein the step of providing the plasma reactor is further characterized as providing an inductively coupled plasma reactor.

13. The process of claim 11, wherein the step of providing the plasma reactor the first plasma generation region and the second plasma generation region are further characterized as being concentric.

14. The process of claim 11, wherein the step of providing the plasma reactor comprises providing a plasma reactor wherein the first plasma generation region is further characterized as comprising a first channel region surrounded by a first coil and the second plasma generation region is further characterized as comprising a second channel region surrounded by a second coil.

15. The process of claim 11, wherein the step of providing the plasma reactor comprises providing a plasma reactor wherein the first plasma generation region is further characterized as having a first gas supply and the second plasma generation region is further characterized as having second gas supply, wherein the first gas supply has a first gas flow rate and a first gas composition and the second gas supply has a second gas flow rate and a second gas composition.

16. The process of claim 15, wherein the step of processing the semiconductor substrate the first gas flow rate is not equal to the second gas flow rate.

17. The process of claim 15, wherein the step of processing the semiconductor substrate the first gas composition is different from the second gas composition.

18. The process of claim 11, wherein the step of processing the semiconductor substrate is further characterized as etching a layer of material on the semiconductor substrate.

19. The process of claim 11, wherein the step of processing the semiconductor substrate is further characterized as depositing a layer of material on the semiconductor substrate.

20. The process of claim 11, wherein the step of providing the plasma reactor comprises providing a plasma reactor wherein the first plasma generation region is further characterized as being powered by a first power supply and the second plasma generation region is further characterized as being powered by a second power supply, the first power supply supplying a first power to the first plasma generation region and the second power supply supplying a second power to the second plasma generation region.

21. The process of claim 20, wherein the step of processing the semiconductor substrate the first power is not equal to the second power.

23. The plasma reactor of claim 11, wherein the plurality of channels is further characterized as a central channel in alignment with the central axis and at least one peripheral channel surrounding the central channel.

24. The plasma reactor of claim 23, wherein the plasma source is separated from the chuck by a separation distance, and wherein the separation distance between the central channel and the chuck is less than the separation distance between the peripheral channel and the chuck.

25. The plasma reactor of claim 23, wherein the plasma source is separated from the chuck by a separation distance, and wherein the separation distance between the central channel and the chuck is greater than the separation distance between the peripheral channel and the chuck.

22. A coaxial multiple coil inductive coupled plasma reactor comprising:

a reaction chamber;

a chuck positioned in the reaction chamber and configured for accepting and supporting a semiconductor wafer on a surface thereof;

a plasma source mounted within the reaction chamber in spaced relationship with the chuck, the plasma source including a plurality of channels, each channel having a gas orifice opening thereto, a gas plenum, and an RF coil surrounding the channel,

wherein each gas orifice provides a passage between the channel and the gas plenum and the plurality of channels are arranged concentrically about a central axis perpendicular to the surface of the chuck;

a dielectric material separating the RF coil from the channel;

independent gas supply lines attached to each gas plenum; and

a gas control system capable of independently charging each gas supply line with a plasma-forming gas, such that a gas composition and a gas flow rate of the plasma-forming gas in each gas supply line can be independently varied.

26. The plasma reactor of claim 22 further comprising an RF shield surrounding each coil and positioned opposite to the dielectric material.

27. The plasma reactor of claim 26, wherein the RF shield comprises a ferromagnetic material.

28. The plasma reactor of claim 26, wherein the RF shield comprises aluminum.