Anode structure for magnetron sputtering systems

• US 5,683,558 A
• Filed: 01/23/1996
• Issued: 11/04/1997
• Est. Priority Date: 07/01/1993
• Status: Expired due to Fees

• Current Assignee: Applied Films Corp. (Applied Materials Incorporated)
• Original Assignee: BOC Group Pty Limited (Linde Plc)
• Inventors: Vossen, John L., Schulz, Stephen C., Sieck, Peter A., Hill, Russell J.
• Primary Examiner(s): Breneman, R. Bruce
• Assistant Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US08/589,920
• Time in Patent Office: 651 Days
• Field of Search: 204/192.12, 204/192.22, 204/192.23, 204/298.06, 204/298.08, 204/298.16, 204/298.19, 204/298.21, 204/298.22, 204/298.28, 204/298.14, 118/723 E, 156/345
• US Class Current: 204/192.12
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01J 37/3405 Magnetron sputtering
• CPC Class Codes: H01J 37/3438 Electrodes other than cathode

Abstract

An elongated anode structure having multiple points to which electrons are attracted is provided. The anode can be constructed of multiple wire brushes that are attached to a metal rod. Use of the anode in magnetron systems significantly reduces dielectric material build-up and improves film uniformity in both dc reactive and non-reactive sputtering. Moreover, the anode reduces overheating and increases the operation time of magnetron systems undergoing reactive sputtering of dielectric materials. In one embodiment, the magnetron system has a cylindrical cathode and a pair of elongated anodes positioned parallel to and equidistance from the cathode. The anode structure is particularly suited for sputtering uniform films of dielectric materials, including silicon dioxide and silicon nitride.

Claims

1. A sputtering apparatus anode device for use in the sputtering of dielectric material, comprising:

at least one anode defining an electrically conductive body and having a plurality of points emanating from said conductive body, each of said points being defined by a tip of a wire.

3. The anode device as defined in claim 1 wherein each anode comprises an electrically conductive central rod having a plurality of metallic wires attached thereto, and wherein each wire comprises means for attracting electrons and for reducing the rate of dielectric material accumulation on the anode during sputtering.

4. The anode device as defined in claim 3 wherein said rod defines one or more gaps that do not have wires attached thereto.

5. The anode device of claim 1 wherein said points are arranged such that a density thereof is substantially uniform along a length of said anode.

6. The anode device of claim 1 wherein said points are arranged such that a density thereof varies along a length of said anode.

7. The anode device of claim 4 wherein said gaps and said points are arranged such that a density of said points is substantially uniform along a length of said anode.

8. The anode device of claim 4 wherein said gaps and said points are arranged such that a density of said points varies along a length of said anode.

9. The anode device of claim 6 or 8 wherein said density is highest in a middle portion of the anode.

2. A plasma electrode for use in plasma applications, comprising an electrically conductive body and a plurality of points emanating from said conductive body, each of said points being defined by a tip of a wire.

10. Apparatus within a vacuum chamber for sputtering a thin film of material onto a position therein containing a substrate surface, comprising:

a target surface that extends across the substrate surface position, including magnets therein facing said position, thereby defining a deposition zone for said material between the target and substrate surface position,

at least one anode structure positioned adjacent the target surface and extending across said substrate surface position,

means electrically connected with the target surface and the anode to maintain the target surface at a negative voltage and the anode structure at a voltage that is positive relative thereto, and

said anode structure including a plurality of individual anode surfaces that are spaced apart in a direction across said substrate surface position with a variable density therealong, thereby to control a profile of a rate of deposition of said material across the substrate surface within said deposition zone.

11. Apparatus according to claim 10 wherein said target surface includes an elongated cylindrically shaped target surface that is rotatable about an axis thereof extending in a direction across the substrate surface position, thereby defining said deposition zone to extend in a direction of said axis.

12. Apparatus according to claim 11 wherein said at least one anode structure is elongated and positioned with its length parallel to the target axis.

13. Apparatus according to claim 10 wherein said target surface includes a planar surface that extends across the substrate surface position.

14. Apparatus according to any one of claims 10-13 wherein the anode structure additionally includes the plurality of individual anode surfaces having a higher density in a middle than at the sides of said substrate surface.

15. Apparatus according to any one of claims 10-13 wherein individual ones of the plurality of individual anode surfaces are defined by a tip of a wire.

16. A method of sputtering a film of material onto a substrate from a target maintained at a negative voltage and positioned within a vacuum chamber into which a process gas is introduced, comprising operating, at a voltage that is more positive than that of the target, a plurality of anode surfaces within the chamber that are arranged with a variable density across the substrate in order to obtain a desired deposition rate profile thereacross.

17. The method of claim 16 wherein operating the plurality of anode surfaces includes operating with a density of said anode surfaces that is greater in a middle portion of the substrate than at opposite sides of the substrate.

18. The method of either one of claims 16 or 17 wherein operating the plurality of anode surfaces includes operating said surfaces in the form of tips of wires.

19. The method of either one of claims 16 or 17 wherein the material of the film being sputtered onto the substrate is a dielectric.