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Apparatus and method for high throughput sputtering

  • US 5,683,561 A
  • Filed: 11/02/1995
  • Issued: 11/04/1997
  • Est. Priority Date: 04/04/1991
  • Status: Expired due to Term
First Claim
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1. A high throughput, in-line sputtering apparatus for providing a single or multi-layer magnetic coating to the surface of a plurality of disk substrates, the plurality of substrates being provided in a planar disk carrier having a top and bottom, said apparatus comprising:

  • a plurality of buffer chambers and a plurality of sputtering chambers;

    an input end and an output end, the buffer and sputtering chambers being positioned between the input end and the output end, wherein at least one buffer chamber is disposed between a first and second ones of the plurality of sputtering chambers; and

    a transport system moving the disk carrier through said buffer and sputtering chambers of said apparatus in a continuous motion at at least a first rate and a second, different rate of speed, the transport system including a coupling mechanism securing the disk carrier at the top of the disk carrier such that the disk carrier is suspended from the coupling mechanism during movement in the chambers of the apparatus.

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