×

Process for producing surface micromechanical structures

  • US 5,683,591 A
  • Filed: 11/27/1995
  • Issued: 11/04/1997
  • Est. Priority Date: 05/25/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for fabricating, on a silicon wafer, at least one micromechanical structure which is at least partially free-standing above a silicon substrate at a distance that is approximately equal to a thickness of a sacrificial layer and is at least partially mounted to the silicon substrate, comprising the steps of:

  • (a) depositing the sacrificial layer on the silicon substrate;

    (b) depositing a second layer on the sacrificial layer, the second layer being patterned;

    (c) performing a vapor-phase etching process including the steps of removing, in an etching operation, the sacrificial layer without removing the second layer by subjecting the silicon wafer to a vapor phase of a mixture, of hydrofluoric acid and water to expose the micromechanical structure, and heating the silicon wafer to adjust an etching rate by controlling the water content on a surface of the silicon wafer.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×