Method of forming vias

• US 5,683,758 A
• Filed: 12/18/1995
• Issued: 11/04/1997
• Est. Priority Date: 12/18/1995
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Kim, Tae Yong, Evans, Michael D., O'Bryan, Henry Miles Jr.
• Primary Examiner(s): PADGETT, MARIANNE L
• Application Number:
  US08/573,923
• Time in Patent Office: 687 Days
• Field of Search: 427/555, 427/526, 427/531, 427/97, 427/99, 427/123, 427/124, 427/125, 427/376.2, 204/192.17, 204/192.15, 216/17, 216/65, 216/94, 156/643.1, 156/644.1, 219/121.66, 219/121.69, 219/121.71, 219/121.72
• US Class Current: 427/555
• CPC Class Codes: H01L 21/4807 Ceramic parts
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/0029 of inorganic insulating material
• CPC Class Codes: H05K 3/0055 After-treatment, e.g. cleaning or desmearing of holes
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: Y10T 29/49163 with sintering of base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.

Claims

1. A method of forming a via in a substrate, wherein said substrate is barium titanate of an ivory color, comprising:

forming an opening in said substrate by exposing said substrate to an energy beam, thereby forming slag in said opening, said slag being adjacent to, but not part of, said substrate;

heating said substrate to 800°

C.-1000°

C., thereby causing said slag to recombine with said substrate, resulting in the ivory color; and

depositing a material upon said substrate and within said opening.

2. The method of claim 1 in which said barium titanate includes an element chosen from the group consisting of cobalt, neodymium, tin, zinc, lanthanide elements, zirconium, and samarium.

3. The method of claim 1 in which said energy beam is a laser beam.

4. The method of claim 3 in which said laser beam is focused upon said substrate.

5. The method of claim 1 in which said heating step is performed for a time between 20 minutes and 8 hours.

6. The method of claim 1 in which said depositing step is performed by sputtering.

7. The method of claim 1 in which said material is metal.

8. The method of claim 7 in which said metal is chosen from the group consisting of copper, titanium, palladium, tin and nickel.