Electronic circuit device

• US 5,684,677 A
• Filed: 07/29/1996
• Issued: 11/04/1997
• Est. Priority Date: 06/24/1993
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Uchida, Tatsuro, Saito, Masayuki, Kizaki, Yukio, Mori, Miki, Togasaki, Takasi, Yebisuya, Takashi
• Primary Examiner(s): Ledynh, Bot L.
• Application Number:
  US08/688,677
• Time in Patent Office: 463 Days
• Field of Search: 257/737-738, 257/778-781, 257/784, 257/786, 228/179.1, 228/180.1, 228/180.21, 228/180.22, 29/876, 29/877, 29/878, 29/879, 437/209, 361/760-774, 361/808, 174/260-261
• US Class Current: 361/770
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/16105 the bump connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/32105 the layer connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/8114 Guiding structures outside the body
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
• CPC Class Codes: H05K 2201/09427 Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2203/0465 Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
• CPC Class Codes: H05K 2203/0568 Resist used for applying paste, ink or powder
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 2203/306 Lifting the component during or after mounting; Increasing the gap between component and PCB
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic circuit device comprising a printed wiring board having a major surface and pads provided on the major surface of the printed wiring board, a plurality of electrodes provided partly on at least one major surface of the leadless component and partly on sides of the leadless component, a plurality of bumps provided on the pads, providing a gap between the major surface of the printed wiring board and the major surface of the leadless component, and electrically connecting those parts of the electrodes which are provided on the major surface of the leadless component to the pads, and a plurality of electrically conductive members integral with the bumps, extending from the bumps to those parts of the electrodes which are provided on the sides of the leadless component.

Claims

1. An electronic circuit device comprising:

a printed wiring board having a major surface and pads provided on the major surfaces;

a leadless component located above the major surface of said printing wiring board and having a major surface opposing the major surface of said printed wiring board;

a plurality of electrodes which are each provided on at least a part of the major surface of said leadless component and one side of said leadless component;

a plurality of bumps electrically connecting said pads to said plurality of electrodes, respectively, so as to provide a distance between opposing ones of said plurality of electrodes of said pads;

a plurality of electrically conductive members integral with said bumps, each one of said plurality of electrically conductive members extending from one of said bumps onto a region of one of said plurality of electrodes that is provided on a side of said leadless component; and

a spacer located in a gap between the major surface of said leadless component and the major surface of said printed wiring board,

wherein the outermost part of each one of said plurality of bumps is located above outside an outer edge of a corresponding one of said pads, as said leadless component is viewed from above.

2. The electric circuit device according to claim 1, wherein each of said pads has an outer edge substantially aligned with an outer edge of that portion of the corresponding electrode which is provided on the major surface of said leadless component.

3. The electric circuit device according to claim 1, wherein an outer surface of each of said bumps and an inner surface of the pad connected to the bump define a contact angle of at least 90°

.

4. The electric circuit device according to claim 1, wherein an outer surface of each of said bumps and an inner surface of the pad connected to the bump define a contact angle of at most 90°

, and the outer surface of the bump is bent by an angle greater than the contact angle.

5. The electric circuit device according to claim 1, wherein a part of each of said bumps looks bulging from the side of said leadless component, as said leadless component is viewed from above.

6. The electric circuit device according to claim 1, wherein an outermost part of each of said bumps looks located substantially at a midpoint on the side of said leadless component, as said leadless component is viewed from above.

7. The electric circuit device according to claim 1, wherein said leadless component is a multi-terminal surface-mount component.

8. The electric circuit device according to claim 1, wherein said leadless component is a two-terminal chip component.