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Polymeric compositions for medical packaging and devices

  • US 5,686,527 A
  • Filed: 06/05/1995
  • Issued: 11/11/1997
  • Est. Priority Date: 11/16/1993
  • Status: Expired due to Term
First Claim
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1. A polymer based composition for fabricating into articles comprising:

  • a first polyolefin containing propylene units, the first polyolefin being in an amount of 30-60% by weight of the composition;

    a second polyolefin containing no propylene units selected from the group consisting of polyethylene, ultra-low density polyethylene, polybutene-1, and butene-1 copolymers, the second polyolefin being in an amount within the range of from 35% to about 50% by weight of the composition;

    a radio frequency susceptible polymer having a dielectric loss greater than 0.05 at 1-60 MHz and ambient temperature to 250°

    C., the radio frequency polymer being selected from the group consisting of ethylene copolymers having 50-85% ethylene content with comonomers selected from the group consisting of acrylic acid, methacrylic acid, ester derivatives of acrylic acid with alcohols having 1-10 carbons, ester derivatives of methacrylic acid with alcohols having 1-10 carbons, vinyl alcohol, and vinyl acetate;

    a styrenic block copolymer with hydrocarbon soft segments; and

    ,the composition having physical properties within the rangea<

    40,000 psi;

    b>

    =70%;

    c<

    30%;

    d>

    1.0;

    e<

    0.1%;

    f<

    0.1%;

    g>

    =0.05h<

    =60%;

    wherein;

    a is the mechanical modulus of the composition measured according to ASTM D-882;

    b is the percent recovery in length of the composition after an initial 20% deformation;

    c is the optical haze of the composition processed into a film 9 mils in thickness measured in accordance to ASTM D-1003;

    d is the loss tangent of the composition at 1 Hz measured at melt processing temperatures;

    e is the elemental halogen content by weight of the composition;

    f is the weight fraction of components capable of leaching from the composition into an aqueous phase;

    g is the dielectric loss between 1 and 60 MHz and over temperatures of 25°

    to 250°

    C. of the composition;

    h is the sample creep measured at 121°

    C. for a 1 inch strip of the composition under 27 psi loading; and

    ,wherein the composition exhibits no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute to about 100% elongation (twice the original length).

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