High-thermal conductivity circuit board

• US 5,687,062 A
• Filed: 02/20/1996
• Issued: 11/11/1997
• Est. Priority Date: 02/20/1996
• Status: Expired due to Fees

• Current Assignee: Hearth Technologies, Inc. (HNI Corporation)
• Original Assignee: Hearth Technologies, Inc. (HNI Corporation)
• Inventors: Larson, Ralph I.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/603,210
• Time in Patent Office: 630 Days
• Field of Search: 174/52.4, 174/252, 174/256-260, 361/706-708, 361/712, 361/713, 361/719-720, 428/901
• US Class Current: 361/706
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/053 : the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/0116 : Porous, e.g. foam
• CPC Class Codes: H05K 2201/015 : Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2203/0315 : Oxidising metal
• CPC Class Codes: H05K 2203/0554 : Metal used as mask for etching vias, e.g. by laser ablation
• CPC Class Codes: H05K 2203/1147 : Sealing or impregnating, e.g. of pores
• CPC Class Codes: H05K 3/427 : initial plating of through-holes in metal-clad substrates
• CPC Class Codes: H05K 3/445 : having insulated holes or insulated via connections through the metal core
• CPC Class Codes: Y10S 428/901 : Printed circuit

Abstract

A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.

Claims

1. A circuit board comprising:

a base layer having first and second opposing surfaces, said base layer provided from a first material having a relatively high thermal conductivity and a coefficient of thermal expansion relatively close to the thermal coefficient of expansion of silicon;

a metal skin layer disposed over each of the first and second opposing surfaces of said base layer, said metal skin layer provided from a second different material which is anodizeable;

an oxide layer having a first surface in contact with said metal skin layer and a having a second surface, the second surface having a plurality of pores formed therein;

a sealant layer having a first surface disposed over the second surface of said oxide layer and a second surface, said sealant layer provided from a thermoplastic resin having an electrically insulative characteristic and having a heat conduction characteristic, and wherein the thermoplastic resin of said sealant layer is disposed to fill the plurality of pores in the oxide layer; and

a metal foil having a first surface disposed over and in contact with the second surface of said sealant layer and having a second opposing surface.

2. A circuit board according to claim 1 wherein:

said base layer is provided from aluminum silicon carbide;

said metal skin layer is provided from aluminum;

said oxide layer is provided as aluminum oxide; and

said metal foil is provided from electro-deposited copper.

3. A circuit board according to claim 2 further comprising:

a semiconductor circuit disposed on and electrically coupled to the second surface of said copper foil.

4. A circuit board according to claim 3 wherein:

a portion of said semiconductor circuit directly contacts the second surface of said copper foil; and

the thermoplastic resin is embedded in substantially all of the pores of said oxide layer.

5. A circuit board according to claim 2 wherein:

said oxide layer is provided having a thickness typically of about 0.002 inch;

said metal skin layer is provided having a thickness typically of about 0.005 inch;

said thermoplastic resin is provided a sheet of thermoplastic resin having a thickness of about 0.002 inch.

6. A circuit board according to claim 5 wherein said thermoplastic resin is provided from fluorinated ethylene propylene.

7. A circuit board according to claim 6 further comprising a layer of Kapton tape to which said semiconductor circuit is mounted, the Kapton tape being in thermal communication with said thermoplastic resin.

8. A circuit board according to claim 7 wherein the heat-dissipating component is a pin-mounted IC package.

9. A circuit board according to claim 6 wherein said semiconductor circuit is a bare die.

10. A circuit board according to claim 9 wherein a first surface of said bare die is in physical contact with said sealant layer.

11. A circuit board comprising:

a base layer of aluminum silicon carbide having first and second opposing surfaces;

a layer of anodized aluminum having a first surface disposed against the first surface of said base layer and having a second porous surface;

a thermoplastic resin embedded in substantially all of the interstitial regions of the porous surface of said anodized aluminum; and

a layer of electrically conductive material in contact with said thermoplastic resin.

12. A method of fabricating a circuit board comprising:

(a) providing a base layer of material having relatively high thermal conductivity;

(b) anodizing the first surface of said base layer to provide a layer of oxide having a porous surface and having a thickness typically of about 0.002 inch;

(c) disposing a thermoplastic resin over the porous surface of the oxide layer;

(d) heating the thermoplastic resin to a temperature corresponding to a melting temperature of the thermoplastic resin such that the thermoplastic resin changes to a liquid state; and

(e) forcing the thermoplastic resin into substantially all of the pores of the oxide layer while the thermoplastic resin is in a liquid state.

13. A method according to claim 12 wherein the step of providing a base layer of material having relatively high thermal conductivity includes the steps of:

providing a base layer of aluminum silicon carbide; and

forming a layer of aluminum over the aluminum silicon carbide base layer to provide the first surface of said base layer.

14. A method according to claim 13 wherein the step of anodizing the first surface of the base layer includes the step of anodizing the layer of aluminum to form a layer of aluminum oxide.

15. A method according to claim 14 wherein the step of forcing the thermoplastic resin into substantially all of the pores of the oxide layer includes the steps of:

applying pressure to the thermoplastic resin while the thermoplastic resin is in a liquid state;

removing pressure from the thermoplastic resin while the thermoplastic resin is in a liquid state; and

drying the thermoplastic resin such that the thermoplastic resin is embedded within substantially all of the interstitial regions of the porous surface of the aluminum oxide layer.

16. A method according to claim 15 further comprising the steps of:

laminating a layer of electrically conductive material to the aluminum oxide layer; and

forming electrical circuit paths from the electrically conductive material.

17. A method according to claim 16 wherein the step of laminating a layer of electrically conductive material to the aluminum oxide layer comprises the steps of disposing a copper foil over the thermoplastic resin;

and

securing the copper foil to the surface of the aluminum oxide layer having the thermoplastic resin embedded in the pores.

18. A method according to claim 17 wherein the step of:

disposing the copper foil over the thermoplastic resin includes the step of disposing the copper foil over the thermoplastic resin while the thermoplastic resin is in a liquid state; and

the step of securing the copper foil to the surface of the aluminum oxide layer includes the step of adhering the copper foil to the oxide layer with the thermoplastic resin.

19. A method according to claim 18 wherein:

the step of heating the thermoplastic resin includes the step of heating the thermoplastic resin to a temperature of about 300°

Celsius; and

the step of applying pressure to the thermoplastic resin includes the step of forcing the thermoplastic resin in a liquid state into the porous surface of the oxide layer at a pressure of about 275 P.S.I.

20. A method according to claim 12 wherein the step of forcing the thermoplastic resin into substantially all of the pores of the provides a thermoplastic resin filled oxide layer having a thickness of about 0.002 inch.

21. A method according to claim 12 further comprising the steps of:

forming a vacuum around the base layer;

removing said vacuum while the thermoplastic resin is in a liquid state.

22. A method according to claim 21 wherein the base material is provided from aluminum silicon carbide having an aluminum skin disposed thereover.