Process and apparatus for forming ball bumps

• US 5,687,901 A
• Filed: 11/14/1995
• Issued: 11/18/1997
• Est. Priority Date: 11/14/1995
• Status: Expired due to Term

• Current Assignee: Nippon Steel Chemical Company Limited (Nippon Steel Corporation)
• Original Assignee: Nippon Steel Corporation
• Inventors: Tatsumi, Kohei, Hoshiba, Hiroshi, Kawakami, Yoji, Konda, Masashi
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US08/557,943
• Time in Patent Office: 735 Days
• Field of Search: 228/41, 228/246, 228/244, 228/254, 228/180.22, 437/183, 427/96
• US Class Current: 228/246
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/742 Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 2203/0292 Using vibration, e.g. during soldering or screen printing
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/3478 : Applying solder preforms; Transferring prefabricated solder patterns
• CPC Class Codes: Y10T 156/108 : Flash, trim or excess removal

Abstract

A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

Claims

1. A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of:

applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel;

holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip;

removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and

simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

2. A process according to claim 1, wherein the electroconductive material is a metal.

3. A process according to claim 1, wherein the small balls have a diameter of 100 μ

m or less.

4. A process according to claim 1, wherein, in the holding and arranging step, the jumping up small balls are attracted to the attraction openings by vacuum suction.

5. A process according to claim 1, wherein, in the holding and arranging step, the arrangement baseplate is held on an arrangement head by its side opposite to a side on which the small balls are held and arranged.

6. A process according to claim 5, wherein the arrangement baseplate is held on the arrangement head by being attracted thereto by vacuum suction.

7. A process according to claim 6, wherein the vacuum suction to attract the arrangement baseplate to the arrangement head and the vacuum suction to attract the small balls to the attraction openings are performed by a common vacuum suction system.

8. A process according to claim 6, wherein the vacuum suction to attract the arrangement baseplate to the arrangement head and the vacuum suction to attract the small balls to the attraction openings are performed by separate vacuum suction systems which are separately controllable.

9. A process according to claim 1, wherein the holding and arranging step further comprises vertically reciprocating the arrangement baseplate at least once to promote selective attraction of the small balls to the attraction openings.

10. A process according to claim 1, wherein the holding and arranging step further comprises vibrating the arrangement baseplate at a small amplitude in a horizontal direction to prevent excess small balls from adhering to the arrangement baseplate.

11. A process according to claim 1, wherein the removing step is performed by vibrating the arrangement baseplate.

12. A process according to claim 11, wherein the vibration is ultrasonic.

13. A process according to claim 1, which further comprises, after the step of removing and before the step of bonding, verifying that each one of the attraction openings attracts thereto one of the small balls of said at least one set.

14. A process according to claim 1, wherein, in the bonding step, the small balls are bonded to inner leads of a film carrier, electrode pads of a semiconductor chip, electrode pads of a printed-circuit board, or electrode pads of a flexible circuit board.

15. A process of forming ball bumps for electrical connection to an integrated circuit, comprising the steps of:

providing a first number of sets of small balls of an electroconductive material arranged on a first arrangement baseplate in positions corresponding to positions of the first number of sets of the electrode pads of one semiconductor chip, the first number being at least one;

simultaneously picking up a second number of sets of the small balls on a second arrangement baseplate by attracting the small balls to attraction openings provided in the second arrangement baseplate in positions corresponding to positions of the second number of sets of the electrode pads, the second number being not more than the first number, to hold and arrange the second number of sets of the small balls on the second arrangement baseplate in positions corresponding to their positions on the first arrangement baseplate; and

simultaneously bonding the second number of sets of the small balls held and arranged on the second arrangement baseplate to bonding spots arranged in positions corresponding to positions of the second number of sets of the electrode pads.

16. A process according to claim 15, wherein the step of providing the small balls arranged on the first arrangement baseplate comprises the substeps of:

providing the first arrangement baseplate having attraction openings in positions corresponding to positions of the first number of sets of the electrode pads of the semiconductor chip;

holding and arranging the small balls on the first arrangement baseplate, by lowering the first arrangement base plate with its side on which the small balls are held and arranged being directed downward into a vessel containing the small balls to attract the small balls to the attraction openings; and

removing excess small balls adhered either to the first arrangement baseplate or to the small balls attracted to the attraction openings.

17. A process according to claim 15, wherein the step of providing the small balls arranged on the first arrangement baseplate comprises the substeps of:

providing the first arrangement baseplate having attraction openings in positions corresponding to positions of the first number of sets of the electrode pads of the semiconductor chip;

applying a vibration at a small amplitude to a vessel containing the small balls to cause the small balls to jump up above the vessel;

holding and arranging the small balls on the first arrangement baseplate, by lowering the first arrangement baseplate with its side on which the small balls are held and arranged being directed downward into the vessel to attract the jumping up small balls to the attraction openings; and

removing excess small balls adhered either to the first arrangement baseplate or to the small balls attracted to the attraction openings.

18. A process according to claim 15, which further comprises, after the step of providing the small balls on the first arrangement baseplate and before the step of picking up the small balls on the second arrangement base plate, the step of verifying that the small balls are held and arranged on the first arrangement baseplate in positions corresponding to positions of the first number of sets of the electrode pads.

19. A process according to claim 15, wherein the electroconductive material is a metal.

20. A process according to claim 15, wherein the small balls have a diameter of 100 μ

m or less.

21. A process according to claim 16, wherein the small balls are attracted to the attraction openings by vacuum suction.

22. A process according to claim 16, wherein the first and second arrangement baseplates are held on first and second arrangement heads, respectively, by their side opposite to a side on which the small balls are held and arranged.

23. A process according to claim 22, wherein the first and second arrangement baseplates are held on the first and second arrangement heads, respectively, by being attracted thereto by vacuum suction.

24. A process according to claim 23, wherein, in at least one of the first and second arrangement baseplates, the vacuum suction to attract the arrangement baseplate to the arrangement head and the vacuum suction to attract the small balls to the attraction openings are performed by a common vacuum suction system.

25. A process according to claim 23, wherein, in at least one of the first and second arrangement baseplates, the vacuum suction to attract the arrangement baseplate to the arrangement head and the vacuum suction to attract the small balls to the attraction openings are performed by separate vacuum suction systems which are separately controllable.

26. A process according to claim 16, wherein the substep of holding and arranging the small balls on the first arrangement baseplate further comprises vertically reciprocating the arrangement baseplate at least once to promote selective attraction of the small balls to the attraction openings.

27. A process according to claim 16, wherein the substep of holding and arranging the small balls on the first arrangement baseplate further comprises vibrating the arrangement baseplate at a small amplitude in a horizontal direction to prevent excess small balls from adhering to the arrangement baseplate.

28. A process according to claim 16, wherein the step of removing excess small balls is performed by applying a vibration to the first arrangement baseplate.

29. A process according to claim 28, wherein the vibration is ultrasonic.

30. A process according to claim 15, wherein the step of simultaneously bonding comprises bonding the small balls to inner leads of a film carrier, electrode pads of a semiconductor chip, electrode pads of a printed-circuit board, or electrode pads of a flexible circuit board.