Antipilferage markers

• US 5,689,263 A
• Filed: 01/07/1994
• Issued: 11/18/1997
• Est. Priority Date: 07/09/1991
• Status: Expired due to Fees

• Current Assignee: Esselte Meto International GmbH
• Original Assignee: Esselte Meto International GmbH
• Inventors: Dames, Andrew
• Primary Examiner(s): Hellner, Mark
• Application Number:
  US08/178,571
• Time in Patent Office: 1,411 Days
• Field of Search: 342/51, 340/572, 156/268, 156/52, 427/96
• US Class Current: 342/51
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]

Abstract

An antipilferage tag is disclosed which includes a resonant circuit adapted to receive an RF signal and to transmit a response signal when interrogated by said RF signal. The tag includes circuit components constituted by or fabricated from a metallized layer supported by a dielectric material.

Claims

1. A method of making a self-adhesive tag, the tag comprising:

a first side and a second side;

a first material disposed on the first side;

a second material disposed on the second side;

an intermediate supporting layer disposed between the first material and the second material;

the intermediate layer having a first side disposed towards the first material and a second side disposed towards the second material;

means for adhering the second material to the second side of the intermediate layer;

an adhesive layer disposed on the second material, the adhesive layer being configured for bonding the tag to a product;

release paper material disposed on the adhesive layer, the release paper material being configured for preventing adhesion of the adhesive layer to undesired surfaces;

said method comprising the steps of;

providing the first material, the first material comprising metal;

providing the second material;

providing the intermediate layer;

configuring the intermediate layer to have a first side and a second side;

providing the adhering means;

providing the adhesive layer;

providing the release paper material;

said method further comprising the steps of;

applying the second material to the second side of the intermediate layer with the adhering means;

disposing portions of the first material in different amounts and at different times on the first side of the intermediate layer;

said step of disposing comprising providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness less than 1 micron;

forming predetermined patterns in the first material and the second material;

coating the second material with the adhesive layer; and

disposing the release paper on the adhesive layer.

2. The method according to claim 1 wherein:

said step of providing the second material comprises providing a metal layer having a thickness, the thickness of the metal layer being substantially greater than the thickness of the first material; and

said step of providing the intermediate layer comprises providing dielectric material.

3. The method according to claim 1 wherein:

said step of providing the second material comprises providing a metal layer having a thickness, the thickness of the metal layer being greater than the thickness of the first material; and

said step of providing the intermediate layer comprises providing dielectric material.

4. A tag made by the method of claim 1.

5. The method according to claim 2 wherein said step of forming comprises etching the first material to form a predetermined pattern, said predetermined pattern comprising a circuit.

6. The method according to claim 3 wherein said step of forming comprises etching the first material to form a predetermined pattern, said predetermined pattern comprising a circuit.

7. The method according to claim 5 wherein:

said step of providing the first material further comprises providing a copper layer; and

said step of disposing comprising providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness of about 0.1 micron.

8. The method according to claim 5 wherein said step of disposing comprises disposing the first material on the first side of the intermediate layer by one of the following methods c), d), e), f), and g):

c) evaporation;

d) sputtering;

e) chemical deposition;

f) vapor deposition; and

g) electroplating.

9. The method according to claim 6 wherein said step of disposing comprises disposing the first material on the first side of the intermediate layer by one of the following methods c), d), e), f), and g):

c) evaporation;

d) sputtering;

e) chemical deposition;

f) vapor deposition; and

g) electroplating.

10. The method according to claim 6 wherein said step of providing the first material comprises providing an aluminum layer.

11. The method according to claim 7 wherein said step of disposing comprises disposing the first material on the first side of the intermediate layer by one of the following methods c), d), e), f), and g):

c) evaporation;

d) sputtering;

e) chemical deposition;

f) vapor deposition; and

g) electroplating.

12. A tag made by the method of claim 7.

13. The method according to claim 8 wherein said step of providing the first material comprises providing an aluminum layer.

14. A tag made by the method of claim 8.

15. The method according to claim 9 wherein:

said step of providing the first material further comprises providing a copper layer; and

said step of disposing comprising providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness of about 0.1 micron.

16. The method according to claim 10 wherein:

said step of disposing comprises providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness of about 0.1 micron; and

said step of disposing comprises disposing the first material on the first side of the intermediate layer by one of the following methods c), d), e), f), and

c) evaporation;

d) sputtering;

e) chemical deposition;

f) vapor deposition; and

g) electroplating.

17. The method according to claim 11 wherein said step of providing the adhesive layer comprises providing at least one of the following a) and b):

a) an elastomer-resin compound, the resin comprising a hydrogenated ester and the elastomer comprising organic polyol and organic diisocyanate; and

b) a polythioether polymer, the polythioether polymer comprising liquid polyene compositions cured to polythiol elastomeric products.

18. The method according to claim 13 wherein said step of disposing comprises providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness of about 0.1 micron.

19. The method according to claim 15 wherein said step of providing the adhesive layer comprises providing at least one of the following a) and b):

a) an ester of acrylic acid with ethylenically unsaturated carboxylic acid; and

b) a conjugated diloefin with vinyl aromatic monomer and ethylenically unsaturated carboxylic acid.

20. A method of making a self-adhesive tag, said method comprising the steps of:

depositing portions of a first material on a first side of an intermediate layer, the first material comprising a metallized coating and the intermediate layer comprising a dielectric material;

said step of depositing comprising providing a layer of the first material on the first side of the intermediate layer, the layer of the first material having a thickness less than 1 micron;

fastening a second material to a second side of the intermediate layer, the second material comprising a metal layer, and the second side of the intermediate layer facing away from the first side of the intermediate layer;

forming predetermined patterns in the first material and the second material;

coating the second material with an adhesive layer; and

disposing release paper on the adhesive layer.

21. The method according to claim 20 wherein said step of forming comprises etching the first material to form a predetermined pattern, said predetermined pattern comprising a circuit.

22. The method according to claim 21 wherein said step of depositing comprises depositing the first material on the first side of the intermediate layer by one of the following methods a), b), c), d), and e):

a) evaporation;

b) sputtering;

c) chemical deposition;

d) vapor deposition; and

e) electroplating.

23. A tag made by the method of claim 20.

24. A tag made by the method of claim 22.