Rapid thermal heating apparatus and control therefor

• US 5,689,614 A
• Filed: 07/31/1995
• Issued: 11/18/1997
• Est. Priority Date: 01/19/1990
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Gibbons, James F., Gronet, Christian M.
• Primary Examiner(s): Walberg, Teresa J.
• Assistant Examiner(s): PELHAM, JOSEPH MOORE
• Application Number:
  US08/509,392
• Time in Patent Office: 841 Days
• Field of Search: 392/416, 392/418, 219/405, 219/411, 219/390, 118/724, 118/725, 118/50.1, 118/728, 118/730, 437/247
• US Class Current: 392/416
• CPC Class Codes: C23C 16/481 by radiant heating of the substrate
• CPC Class Codes: C23C 16/482 using incoherent light, UV to IR, e.g. lamps
• CPC Class Codes: C30B 25/10 Heating of the reaction chamber or the substrate
• CPC Class Codes: C30B 25/105 by irradiation or electric discharge
• CPC Class Codes: C30B 31/12 Heating of the reaction chamber
• CPC Class Codes: C30B 31/18 Controlling or regulating
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: F27D 99/0006 Electric heating elements or system
• CPC Class Codes: F27D 99/0033 using burners manufacture of steel in an electric arc furnace equipped with burners C21C5/5217
• CPC Class Codes: G01J 5/0003 for sensing the radiant heat transfer of samples, e.g. emittance meter
• CPC Class Codes: G01J 5/06 Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H02G 3/0425 Plinths borders for use between floor or ceiling and wall E04F19/04

Abstract

A rapid thermal heating apparatus in which lamps are disposed in a plurality of light pipes arranged to illuminate and supply heat to a substrate. The light pipes are positioned so that the illumination patterns overlap. The energy supplied to the lamps is controlled to provide a predetermined heating pattern to the substrate. A liquid cooled window cooperates with the light pipes to transmit energy to a wafer disposed in an evacuated chamber.

Claims

1. A heat source for heating a semiconductor wafer during rapid thermal processing, comprising:

a plurality of sources of radiant energy, each radiant energy source including a surrounding light pipe and serving to radiate a predetermined defined area of said semiconductor wafer with a pattern of radiation intensity;

a mounting means for mounting said light pipes and said radiant energy sources next to each other so that a portion of the radiated defined area of one radiant energy source overlaps a portion of the radiated defined area of an adjacent radiant energy source; and

a control means for controlling the intensity of each of said radiant energy sources to control the radiation at different areas of said semiconductor wafer.

2. An apparatus for the rapid thermal processing of a substrate, comprising:

an evacuable chamber having a window;

a plurality of radiant energy sources disposed outside of said chamber and positioned adjacent to said window, said radiant energy sources having a central longitudinal axis that extends in a substantially perpendicular direction relative to said window;

reflectors associated with said radiant energy sources to direct radiant energy through said window to radiate predetermined regions of a substrate in said chamber with a pattern of radiation intensity, said reflectors extending along a major portion of said longitudinal axis of said radiant energy sources, and said radiant energy sources and said reflectors positioned so that a portion of a predetermined region radiated by one radiant energy source overlaps a portion of a predetermined region radiated by an adjacent radiant energy source to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources;

sensors to determine the temperature of different regions of the substrate and to output a signal representative thereof; and

a computer programmed to control the intensity of said radiant energy sources in response to a signal received from said sensors to thereby control the temperature of different regions of the substrate.

3. The apparatus of claim 2 wherein said computer is programmed to maintain a predetermined temperature profile across the substrate during rapid thermal processing of the substrate.

4. An apparatus for the rapid thermal processing of a substrate, comprising:

an evacuable chamber having a window;

a plurality of radiant energy sources disposed outside of said chamber and positioned adjacent to said window, said radiant energy sources having a central longitudinal axis that extends in a substantially perpendicular direction relative to said window;

a plurality of individual reflectors associated with selected ones of said radiant energy sources to direct radiant energy through said window to radiate predetermined regions of a substrate in said chamber with a pattern of radiation intensity, said reflectors extending along a major portion of said longitudinal axis of said radiant energy sources and the walls of said reflectors extending in a substantially perpendicular direction relative to said window, and said radiant energy sources and said reflectors positioned so that a portion of a predetermined region radiated by one radiant energy source overlaps a portion of a predetermined region radiated by an adjacent radiant energy source to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources;

sensors to determine the temperature of different regions of the substrate and to output a signal representative thereof; and

a computer programmed to control the intensity of said radiant energy sources in response to a signal received from said sensors to thereby control the temperature of the substrate.

5. An apparatus for the rapid thermal processing of a substrate, comprising:

an evacuable chamber having a window;

a plurality of radiant energy sources disposed outside of said chamber and positioned adjacent to said window, said radiant energy sources having a central longitudinal axis that extends in a substantially perpendicular direction relative to said window;

reflectors associated with said radiant energy sources to direct radiant energy through said window to radiate predetermined regions of a substrate in said chamber with a pattern of radiation intensity, said reflectors extending along a major portion of said longitudinal axis of said radiant energy sources and the walls of said reflectors extending in a substantially perpendicular direction relative to said window, and said radiant energy sources and said reflectors positioned so that a portion of a predetermined region radiated by one radiant energy source overlaps a portion of a predetermined region radiated by an adjacent radiant energy source to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources; and

a control means for controlling the intensity of each of said radiant energy sources to control the radiation at different areas of said substrate.

6. An apparatus for the rapid thermal processing of a substrate, comprising:

an evacuable chamber having a window;

an assembly of radiant energy sources disposed outside of said chamber, said radiant energy sources having a central longitudinal axis that extends in a substantially perpendicular direction relative to said window and subsets of said radiant energy sources disposed at different radii of the assembly and each radiant energy source terminating in a common plane adjacent to said window;

reflectors associated with said radiant energy sources to direct radiant energy through said window to radiate predetermined regions of a substrate in said chamber with a pattern of radiation intensity, said reflectors extending along a major portion of said longitudinal axis of said radiant energy sources and the walls of said reflectors extending in a substantially perpendicular direction relative to said window, and said radiant energy sources and said reflectors positioned so that a portion of one of said predetermined regions radiated by one of said radiant energy sources overlaps a portion of a predetermined region radiated by an adjacent one of said radiant energy sources to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources;

sensors to determine the temperature of different regions of the substrate and to output a signal representative thereof; and

a computer programmed to control the intensity of said radiant energy sources in response to a signal received from said sensors to thereby control the temperature of the substrate.

7. A heating system for the rapid thermal processing of a substrate, comprising:

plurality of radiant energy sources having a central longitudinal axis;

light pipes associated with each of said radiant energy sources to direct radiant energy onto a substrate to radiate predetermined regions of the substrate with a pattern of radiation intensity, said light pipes surrounding and extending along a major portion of said longitudinal axis of said radiant energy sources, and said radiant energy sources and said light pipes positioned so that a portion of one of said predetermined regions radiated by one of said radiant energy sources overlaps a portion of a predetermined region radiated by an adjacent one of said radiant energy sources to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources;

sensors to determine the temperature of different regions of the substrate and to output a signal representative thereof; and

a computer programmed to control the intensity of said radiant energy sources in response to signals received from said sensors to thereby control the temperature of the substrate.

8. A heating system for the rapid thermal processing of a substrate, comprising:

plurality of radiant energy sources having a central longitudinal axis;

light pipes associated with said radiant energy sources to direct radiant energy onto a substrate to radiate predetermined regions of the substrate with a pattern of radiation intensity, said light pipes surrounding and extending along a major portion of said longitudinal axis of said radiant energy sources and said light pipes extending in a substantially perpendicular direction relative to a horizontal plane extending through the substrate, and said radiant energy sources and said light pipes positioned so that a portion of one of said predetermined regions radiated by one of said radiant energy sources overlaps a portion of a predetermined region radiated by an adjacent one of said radiant energy sources to provide a radiation intensity across the substrate that is dependent upon the intensity of adjacent radiant energy sources;

sensors to determine the temperature of different regions of the substrate and to output a signal representative thereof; and

a computer programmed to control the intensity of said radiant energy sources in response to signals received from said sensors to thereby control the temperature of the substrate.