Method for the manufacture of a contact-free or hybrid card
First Claim
Patent Images
1. A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, wherein:
- a frame is deposited on a lower thermoplastic sheet, thereby demarcating the edges of a cavity;
the electronic module is positioned at the bottom of said cavity;
this cavity is filled with a polymerizable resin;
the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied;
the resin is polymerized; and
the card is cut out within the frame.
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Abstract
A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, a frame is deposited on a lower thermoplastic sheet demarcating the edges of a cavity; the electronic module is positioned at the bottom of the cavity; this cavity is filled with a polymerizable resin; and the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied. The resin polymerizes, and the card is cut out within the frame.
156 Citations
15 Claims
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1. A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, wherein:
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a frame is deposited on a lower thermoplastic sheet, thereby demarcating the edges of a cavity; the electronic module is positioned at the bottom of said cavity; this cavity is filled with a polymerizable resin; the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied; the resin is polymerized; and the card is cut out within the frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, wherein:
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a frame is deposited on a lower thermoplastic shift, thereby demarcating the edges of a cavity, wherein the frame has through holes connecting the inner edges of said frame to its outer edges; the electronic module is positioned at the bottom of said cavity; this cavity is filled with a polymerizable resin; the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied; and the resin is polymerized.
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13. A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, wherein:
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a frame is deposited on a lower thermoplastic sheet thereby demarcating the edges of a cavity; the electronic module is positioned at the bottom of said cavity; the cavity is filled with a polymerizable resin; the frame and the resin-filled cavity are covered with an upper thermoplastic sheet; a second frame determining the final thickness of the card is placed around a unit constituted by the lower sheet, the frame, and the upper sheet; slight pressure is applied to said upper thermoplastic sheet; and the resin is polymerized, whereto the second frame demarcates a cavity whose width and length are greater than the width and length of the unit formed by the lower sheet, the frame, and the upper sheet.
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14. A method of manufacturing a contact-free or a hybrid card comprising a card body and an electronic module, said electronic module comprising an antenna and an integrated circuit chip connected to said antenna, said method comprising:
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(A) depositing a frame on a lower thermoplastic sheet, said frame demarcating edges of a cavity, said cavity having a bottom; (B) positioning said electronic module at the bottom of said cavity; (C) filling said cavity with a polymerizable resin; (D) covering said resin-filled cavity and said frame with an upper thermoplastic sheet; (E) applying slight pressure m said upper sheet; (F) polymerizing said resin; and (G) cutting said card out within said frame. - View Dependent Claims (15)
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Specification