Maskless, reticle-free, lithography

• US 5,691,541 A
• Filed: 05/14/1996
• Issued: 11/25/1997
• Est. Priority Date: 05/14/1996
• Status: Expired due to Term

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America), Ultratech Stepper, Inc. (Veeco Instruments Incorporated)
• Original Assignee: Regents of the University of California (University of California), Ultratech Stepper, Inc. (Veeco Instruments Incorporated)
• Inventors: Markle, David A., Ceglio, Natale M.
• Primary Examiner(s): ANDERSON, BRUCE C
• Application Number:
  US08/645,531
• Time in Patent Office: 560 Days
• Field of Search: 250/492.1, 250/492.2, 250/492.3, 378/34
• US Class Current: 250/492.1
• CPC Class Codes: G03F 7/70041 by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70475 Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Abstract

A lithography system in which the mask or reticle, which usually carries the pattern to be printed onto a substrate, is replaced by a programmable array of binary (i.e. on/off) light valves or switches which can be programmed to replicate a portion of the pattern each time an illuminating light source is flashed. The pattern of light produced by the programmable array is imaged onto a lithographic substrate which is mounted on a scanning stage as is common in optical lithography. The stage motion and the pattern of light displayed by the programmable array are precisely synchronized with the flashing illumination system so that each flash accurately positions the image of the pattern on the substrate. This is achieved by advancing the pattern held in the programmable array by an amount which corresponds to the travel of the substrate stage each time the light source flashes. In this manner the image is built up of multiple flashes and an isolated defect in the array will only have a small effect on the printed pattern. The method includes projection lithographies using radiation other than optical or ultraviolet light. The programmable array of binary switches would be used to control extreme ultraviolet (EUV), x-ray, or electron, illumination systems, obviating the need for stable, defect free masks for projection EUV, x-ray, or electron, lithographies.

Claims

1. A maskless lithography system comprising;

a programmable array of binary light switches (PABLS), said programmable array comprising active elements that can be digitally programmed to direct, or not direct, incident light into a fixed pupil location,

a pulsed or strobed radiation source that illuminates the programmable array with a sequence of pulses,

a projection system that images the array pattern onto a substrate, and

a scanning substrate stage that is in motion during the sequence of pulses but which moves only a small fraction of a minimum feature size during the time duration of a single pulse.

2. The lithography system of claim 1 wherein the PABLS comprises a digital micro-mirror device.

3. The lithography system of claim 1 further comprising a staggered collection of programmable arrays arranged so that the edges of the active element arrays are aligned with each other and with the direction of scanning.

4. The lithography system of claim 1 wherein said pulsed radiation source comprises a pulsed laser or photodiode array as a source of visible or ultraviolet radiation with an exposing wavelength between 7000 Å

and 1200 Å

.

5. The lithography system of claim 4 wherein the pulsed laser is an excimer laser, a copper vapor laser or a diode pumped solid state laser.

6. The lithography system of claim 1 wherein said pulsed radiation source comprises a continuous radiation emitter which is modulated by a high frequency shutter.

7. The lithography system of claim 1 wherein said pulsed radiation source comprises a pulsed source of extreme ultraviolet (EUV) or soft x-ray radiation with a wavelength between 50 Å

and 200 Å

.

8. The lithography system of claim 7 wherein the programmable array comprises EUV or soft x-ray mirrors.

9. The lithography system of claim 1 wherein the pulsed radiation source is a light source and the projection system includes a projection lens with a pupil, and further comprising an illumination system containing a relay lens to bring the light from the source into a light pipe or fly'"'"'s eye lens array, a number of imaging lenses and/or mirrors to image light exiting the light pipe or fly'"'"'s eye lens array in a uniform distribution onto the programmable array, and an illumination pupil which is imaged onto the pupil of the projection lens.

10. The lithography system of claim 1 further comprising an electronic control system that coordinates the transfer of digital image data from a memory to the programmable array between radiation pulses and the triggering of the radiation source when the substrate on the scanning stage is correctly positioned to receive the image stored in the programmable array.

11. The lithography system of claim 10 wherein said control system exposes each geometry on the substrate with multiple pulses.

12. The lithography system of claim 11 wherein said control system varies the position of the image edges on the substrate between pulses so as to achieve precise control of the position of each edge to within a small fraction (<

0.5) of the projected size of a single programmable array pixel.

13. The lithography system of claim 10 wherein said control system electronically adjusts the scale and distortion of the image in the programmable array so as to compensate for distortion inherent in the projection system and/or distortion caused by process induced or other changes in the scale and overall geometrical fidelity of the previous patterns printed on the substrate.

14. The lithography system of claim 10 wherein said control system electronically introduces image distortions that are equal in magnitude and opposite in sign to the distortions caused by imperfections in the positioning of the programmable array elements with respect to each other so that the resulting, image contains no geometrical imperfections.

15. The lithography system of claim 1 wherein said programmable array is programmed to scan and align the position of the image in the programmable array so that it is optimally positioned and oriented with respect to previously printed patterns on the substrate.

16. The lithography system of claim 1 further comprising;

a photocathode that receives the projected image of the programmable array and generates photoelectrons, and

an electron lens which images the photoelectrons onto the substrate.

17. The lithography system of claim 16 wherein the photocathode comprises a negative electron affinity material or electron photoemissive material.

18. A method for maskless lithography comprising;

programming a programmable array of binary light switches (PABLS) to reflect a desired array pattern, said programmable array comprising active elements that can be digitally programmed to direct, or not direct, incident light into a fixed pupil location,

illuminating the programmable array with a sequence of radiation pulses,

imaging the array pattern onto a substrate, and

moving the substrate during the sequence of pulses but only a small fraction of a minimum feature size during the time of a single pulse.

19. The method of claim 18 further comprising forming the programmable array of active elements that can be digitally programmed to direct, or not to direct, incident light into a fixed pupil location.

20. The method of claim 18 wherein the step of imaging the array pattern onto the substrate further comprises:

receiving the array pattern image on a photocathode to generate photoelectrons, and

imaging the photoelectrons onto the substrate.