Process for treating disk-shaped workpieces with a liquid

• US 5,693,149 A
• Filed: 04/17/1996
• Issued: 12/02/1997
• Est. Priority Date: 10/27/1993
• Status: Expired due to Fees

• Current Assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG
• Original Assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG
• Inventors: Wengbauer, Rudolf, Pichlmeier, Ludwig, Passer, Bernd
• Primary Examiner(s): Warden, Robert J.
• Assistant Examiner(s): CHAUDHRY, SAEED T
• Application Number:
  US08/634,527
• Time in Patent Office: 594 Days
• Field of Search: 134/26, 134/27, 134/28, 134/29, 134/30, 134/36, 134/37, 134/34, 134/94.1, 134/95.1, 134/200, 134/902, 95/149
• US Class Current: 134/26
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: B08B 3/08 the liquid having chemical or dissolving effect substances used, see the relevant classes
• CPC Class Codes: H01L 21/02043 Cleaning before device manufacture, i.e. Begin-Of-Line process
• CPC Class Codes: H01L 21/02046 Dry cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels

Abstract

A process for treating disk-shaped workpieces with a liquid in a chamber which can be sealed in gas-tight manner, in which the workpieces stacked in a transport rack are brought into contact with the fed-in liquid in the closed chamber, the liquid is conducted away out of the chamber and noxious vapors or gases originating from the liquid are scrubbed out and are conducted away out of the chamber in the dissolved condition.

Claims

1. A process for treating disk-shaped workpieces with a solvent in a closed chamber which is sealed in a gas tight manner, comprising

bringing the workpieces stacked in a transport rack into the chamber;

closing and sealing said chamber in a gas tight manner to prevent the emission of noxious vapors or gases from said chamber; and

contacting the workpieces with the solvent fed into the chamber;

conducting the solvent away out of the chamber;

scrubbing out noxious vapors or gases by feeding or spraying a liquid into the chamber;

said liquid being selected from the group consisting of water, and aqueous solutions; and

conducting said noxious vapors or gases dissolved in the liquid away out of the chamber.

2. The process as claimed in claim 1,

wherein the solvent is an organic solvent.

3. The process as claimed in claim 1,

wherein hot water is fed into the chamber to completely cover the workpieces and, afterwards, the hot water is slowly removed again from the chamber, the workpieces being dried when the hot water drains off.

4. The process as claimed in claim 1,

wherein hot water at a temperature of 85°

C. to 95°

C. is fed into the chamber to completely cover the workpieces and, afterwards, the hot water is slowly removed again from the chamber, the workpieces being dried at the phase boundary of the water when the hot water drains off, without having to be moved and without a drying gas stream having to be fed in.

5. The process as claimed in claim 1,

wherein the workpieces are semiconductor wafers.

6. The process as claimed in claim 1, comprising

continuing the treatment of the workpieces by bringing the workpieces into contact with the same liquid or a liquid different therefrom.

7. A process for treating disk-shaped workpieces with a solvent in a closed chamber which is sealed in a gas tight manner, comprising

bringing the workpieces stacked in a transport rack into the chamber;

closing and sealing said chamber in a gas tight manner to prevent the emission of noxious vapors or gases from said chamber; and

contacting the workpieces with the solvent fed into the chamber;

conducting the solvent away out of the chamber;

scrubbing out noxious vapors or gases by feeding or spraying cold water into the chamber; and

conducting said noxious vapors or gases dissolved in the cold water away out of the chamber.