Infrared detector

• US 5,693,942 A
• Filed: 04/03/1996
• Issued: 12/02/1997
• Est. Priority Date: 04/07/1995
• Status: Expired due to Fees

• Current Assignee: Ishizuka Electronics Corporation
• Original Assignee: Ishizuka Electronics Corporation
• Inventors: Ishida, Hiroyuki, Fuse, Takeshi, Endo, Haruyuki
• Primary Examiner(s): FIELDS, CAROLYN
• Application Number:
  US08/626,105
• Time in Patent Office: 608 Days
• Field of Search: 250/338.1, 250/338.3
• US Class Current: 250/338.1
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An infrared detector has a sensor with an infrared detecting portion composed of a thermal sensitive resistor film on an insulating film provided on a surface of a semiconductor substrate. The sensor is installed on a base such that it bridges a cavity in the substrate. The cavity is sealed by an infrared reflecting film or an infrared reflecting metallic board.

Claims

1. An infrared detector comprising:

an infrared sensor having an infrared detecting portion composed of a thermal sensitive resistor film on an insulating film provided on a surface of a semiconductor substrate;

a cavity of said substrate;

the infrared sensor, which makes said infrared detecting portion crossbridging in construction over said cavity, installed on a base;

a penetration formed on a portion of said base facing to said infrared detecting portion, on which base said infrared sensor is placed; and

an infrared reflecting film for sealing said penetration from outside of said base.

2. An infrared detector comprising:

an infrared sensor having an infrared detecting portion composed of a thermal sensitive resistor film on an insulating film provided on a surface of a semiconductor substrate;

a cavity of said substrate;

the infrared sensor, which makes said infrared detecting portion crossbridging in construction over said cavity, installed on a base;

a penetration formed on a portion of said base facing to said infrared detecting portion, on which base said infrared sensor is placed; and

an infrared reflecting board of a high infrared reflection factor made of a metallic board for sealing said penetration from outside of said base.