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Multiprobing semiconductor test method for testing a plurality of chips simultaneously

  • US 5,694,050 A
  • Filed: 03/08/1996
  • Issued: 12/02/1997
  • Est. Priority Date: 11/30/1992
  • Status: Expired due to Fees
First Claim
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1. In semiconductor test equipment, in which probes are placed into contact with the electrode pads of semiconductor chips on a semiconductor wafer and a test head provides and receives test signals through said probes thereby checking the electrical properties of said semiconductor chips sequentially, a multiprobing semiconductor test method comprising the steps of:

  • to test a plurality of adjacent semiconductor chips simultaneously, providing as many probes as the number of semiconductor chips to be tested simultaneously;

    providing said test head which is capable of providing and receiving test signals for said plurality of semiconductor chips simultaneously; and

    dividing each column of chips into groups, said column extending along the direction that said semiconductor chips to be tested simultaneously are arranged, each group being for simultaneous testing, when the number of groups in adjacent columns is different, displacing a center position of one of the groups in the adjacent column from a corresponding center position of a group in the other adjacent column such that the groups are not arranged in a straight line in a row direction with a group in an adjacent column, and when the number of groups in adjacent columns is the same, the center position of groups in adjacent columns are arranged adjacently such that the groups are arranged in a straight line in a row direction with a group in an adjacent column.

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