Molded patch antenna having an embedded connector and method therefor

• US 5,694,135 A
• Filed: 12/18/1995
• Issued: 12/02/1997
• Est. Priority Date: 12/18/1995
• Status: Expired due to Term

• Current Assignee: Quarterhill Inc. (f/k/a Wi-LAN Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Dikun, Raymond, Burrell, Dennis, Dickirson, David M.
• Primary Examiner(s): Le, Hoanganh T.
• Application Number:
  US08/573,975
• Time in Patent Office: 715 Days
• Field of Search: 343/700 MS, 343/904, 343/906, 343/905, 343/702, 343/829, 343/830, 343/846, 343/848
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/50 Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

An antenna (100) has a connector (200) having a ground lead (102) and a signal lead (114). A dielectric (112) captures and embeds the connector (200) forming a connector substrate assembly (120) having a first side (122) and a second opposite side (124). A first conductive material (104) is affixed to the first side (122) of the connector substrate assembly (120) and coupling to the ground lead (102) and a second conductive material (110) is affixed to the second opposite side (124) of the connector substrate assembly (112) coupling the signal lead (114).

Claims

1. A method for forming a molded patch antenna having an embedded connector, comprising the steps of:

(a) forming a connector by coupling a cylindrical housing terminating in a cylindrical ground lead with a circular signal lead;

(b) injecting dielectric insulating the cylindrical ground lead from the circular signal lead forming a connector substrate assembly having first side coupled with the cylindrical ground lead and a second opposite side for coupling with the circular signal lead;

(c) removing the connector substrate assembly from the mold;

(d) affixing a conductive material to the first side of the connector substrate assembly thereby coupling to the cylindrical ground lead; and

(e) affixing another conductive material to the second opposite side of the connector substrate assembly thereby coupling to the circular signal lead.

2. A method forming a molded patch antenna having a connector being embedded therein, comprising the steps of:

(a) coupling a circular signal terminal with a cylindrical ground terminal in the mold;

(b) injecting dielectric for capturing and insulating the circular signal terminal centrally positioned within the cylindrical ground terminal of the connector to form a connector substrate assembly;

(c) affixing a conductive surface to a first side of the connector substrate assembly thereby coupling to the cylindrical ground terminal of the connector; and

(d) affixing second conductive surface to an opposite side of the connector substrate assembly thereby coupling to the circular signal terminal of the connector.

3. The method according to claim 2 wherein the step (b) of injecting further comprising a step of obtaining a predetermined impedance.

4. The method according to claim 2 wherein the step (b) of injecting further comprising a step of forming a connector.

5. An antenna, comprising:

a connector having a cylindrical ground lead and a circular signal lead;

a dielectric capturing and embedding the circular signal lead centrally located within the cylindrical ground lead of the connector forming a connector substrate assembly having a first side and a second opposite side;

a first conductive surface affixed to the first side of the connector substrate assembly being electrically coupled to the cylindrical ground lead; and

a second conductive surface affixed to the second opposite side of the connector substrate assembly being electrically coupled to the circular signal lead.

6. The antenna according to claim 5 wherein the connector comprises a coaxial connector.

7. The antenna according to claim 5 wherein the first and second conductive surfaces are copper.

8. The antenna according to claim 5 wherein the connector has a predetermined impedance.

9. An antenna, comprising:

a circular signal terminal;

a cylindrical ground terminal;

a dielectric embedding the circular signal terminal centrally located within the cylindrical ground terminal to form a connector substrate assembly having a predetermined impedance;

a copper surface affixed to a first side of the connector substrate assembly being coupled to the cylindrical ground terminal; and

a copper surface affixed to a second opposite side of the connector substrate assembly coupled to the circular signal terminal.

10. A portable communication device comprising:

a receiver coupled to a molded patch antenna and decoder controller, the molded patch antenna comprising;

a circular signal terminal;

a cylindrical ground terminal;

a dielectric embedding the circular signal terminal centrally within the cylindrical ground terminal to form a connector substrate assembly having a predetermined impedance;

a first conductive surface affixed to a first side of the connector substrate assembly being coupled to the cylindrical ground terminal; and

a second conductive surface affixed to a second opposite side of the connector substrate assembly coupled to the circular signal terminal.

11. The portable communication device according to claim 10 wherein the first and second conductive surfaces are copper.

12. A portable communication device comprising:

a receiver coupled to an antenna and a decoder/controller, the antenna comprising;

a connector having a cylindrical ground lead and a circular signal lead;

a dielectric capturing and embedding the circular signal lead centrally positioned within the cylindrical ground lead of the connector forming a connector substrate assembly having a first side and a second opposite side;

a first conductive surface affixed to the first side of the connector substrate assembly being coupled to the cylindrical ground lead; and

a second conductive surface affixed to the second opposite side of the connector substrate assembly being coupled to the circular signal lead.

13. The portable communication device according to claim 12 wherein the first and second conductive surfaces are copper.

14. The portable communication device according to claim 12 wherein the connector has a predetermined impedance.

15. The portable communication device according to claim 12 wherein the connector comprises a co-axial connector.