Resonant tag and method of manufacturing the same

• US 5,695,860 A
• Filed: 09/01/1995
• Issued: 12/09/1997
• Est. Priority Date: 08/06/1990
• Status: Expired due to Fees

• Current Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Original Assignee: Tokyo Electron Limited
• Inventors: Suzuki, Yuji, Matsumoto, Takeshi, Imaichi, Hideaki, Haneda, Tadayoshi, Himura, Koichi
• Primary Examiner(s): MULVANEY, ELIZABETH EVANS
• Application Number:
  US08/522,956
• Time in Patent Office: 830 Days
• Field of Search: 428/209, 428/461, 428/515, 428/901, 216/6, 216/47, 216/13, 216/52, 156/631.1, 156/634.1, 156/645.1, 156/656.1, 156/659.11, 156/661.11, 156/902, 340/572
• US Class Current: 428/209
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G01S 13/753 using frequency selective elements, e.g. resonator
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: H03H 3/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
• CPC Class Codes: H03H 5/003 comprising distributed impedance elements together with lumped impedance elements
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes parallel traces in one plane H05K2201/09236
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31909 : Next to second addition polymer from unsaturated monomers

Abstract

A resonant tag has one electrode plate of a capacitor and an electric circuit, which is electrically connected to the capacitor, formed on one surface of the insulating film composing the resonant circuit. On the other surface of the insulating film, the other electrode plate of the capacitor, which is electrically connected to the electric circuit, is formed. Heat pressing is performed on the insulating film existing between the two electrode plates with a predetermined pressure and at a predetermined temperature to shorten a distance between these electrode plates, and a crystal structure of the insulating film is destroyed to form a penetrating hole which penetrates through both the electrode plates.

Claims

1. A resonant tag in which a resonant circuit including a capacitor is formed,

one electrode plate of said capacitor and an electric circuit formed on one surface of an insulating film, said electric circuit being electrically connected to said capacitor, and

another electrode plate of said capacitor formed on the other surface of said insulating film, said another electrode being electrically connected to said electric circuit,

wherein said insulating film lying between the two electrode plates has a portion with a thinner film thickness than that of its remaining portion, and a crystal structure of said thin insulating film portion is destroyed to form a penetrating hole extending through the insulating film to both the electrode plates.

2. A resonant tag according to claim 1, wherein a protrusion is formed circumferentially around said portion of the insulating film with a thin film thickness.

3. A resonant tag according to claim 1 or 2, wherein a break, through which said insulating film is exposed, is formed in either one of the electrode plates of said capacitor.

4. A method of manufacturing a resonant tag in which a resonant circuit including a capacitor is formed, comprising the steps of:

forming one electrode plate of said capacitor and an electric circuit on one surface of an insulating film, said electric circuit being electrically connected to said capacitor;

forming another electrode plate of said capacitor at a position opposite said one electrode plate on the other surface of said insulating film, said another electrode plate being electrically connected to said electric circuit; and

performing heat pressing by applying a predetermined pressure to the insulating film lying between the two electrode plates at a predetermined temperature to shorten a distance between the electrode plates, and then to destroy a crystal structure of said insulating film to form a penetrating hole extending through the insulating film to both the electrode plates.

5. A method of manufacturing a resonant tag according to claim 4, wherein said heat pressing is conducted until a break is formed on either one of said electrode plates, through which break said insulating film is exposed.

6. A method of manufacturing a resonant tag according to claim 4 or 5, wherein said another electrode plate is thinner in film thickness than that of said one electrode plate, and said heat pressing step is conducted by supporting the side of said one electrode plate with a supporter and by pressing said another electrode plate with heat by using a jig die.

7. A method of manufacturing a resonant tag according to claim 6, wherein said supporter includes a two-layer structure consisting of a layer of elastic, heat-resistant material and a metal layer, and supports said one electrode plate with said metal layer contacting with said one electrode plate.

8. A method of manufacturing a resonant tag according to claim 6, further including the step of heating said jig die and wherein one end of said jig die, which contacts with said other electrode plate, is tapered around its periphery toward its central axis, and wherein the end face of said tapered end contacts said another electrode plate to conduct heat pressing.

9. An apparatus for performing heat press on an insulating film, comprising:

a supporter for supporting one side of said insulating film, said supporter comprising a two-layer structure including a layer of elastic, heat-resistant material; and

a jig for pressing the other side of said insulating film with heat, and including heating means and a jig die, one end of said jig die, which contacts with an electrode plate the other side of the insulating film, is tapered around its periphery toward its central axis.