Light-emitting semiconductor device

• US 5,696,389 A
• Filed: 03/13/1995
• Issued: 12/09/1997
• Est. Priority Date: 03/15/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kamata, Atsushi, Parbrook, Peter James, Yoshida, Hiroaki, Onomura, Masaaki, Nishikawa, Yukie, Saito, Shinji, Ishikawa, Masayuki, Rennie, John, Sugawara, Hideto, Nitta, Koichi, Hatakoshi, Genichi
• Primary Examiner(s): JACKSON JR, JEROME
• Application Number:
  US08/402,659
• Time in Patent Office: 1,002 Days
• Field of Search: 257/773, 257/99, 372/44, 372/50
• US Class Current: 257/99
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/145 with a current-blocking structure
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01S 2301/203 with at least one hole in the intensity distribution, e.g. annular or doughnut mode
• CPC Class Codes: H01S 5/0422 with n- and p-contacts on the same side of the active layer
• CPC Class Codes: H01S 5/04252 characterised by the material
• CPC Class Codes: H01S 5/04256 characterised by the configuration
• CPC Class Codes: H01S 5/04257 having positive and negative electrodes on the same side of the substrate
• CPC Class Codes: H01S 5/18341 Intra-cavity contacts
• CPC Class Codes: H01S 5/1835 Non-circular mesa
• CPC Class Codes: H01S 5/22 having a ridge or stripe structure
• CPC Class Codes: H01S 5/347 in AIIBVI compounds, e.g. ZnCdSe- laser
• CPC Class Codes: H01S 5/4087 emitting more than one wavelength

Abstract

A light-emitting semiconductor device comprising an n-type cladding layer provided on a surface of a substrate and having concentric first and second parts, a first electrode mounted on the first part of the n-type cladding layer, a p-type cladding layer provided above the surface of the substrate and surrounding the first electrode and the second part of the n-type cladding layer, and a second electrode provided on the p-type cladding layer.

Claims

1. A light-emitting semiconductor diode comprising:

a first compound semiconductor layer of a first conductivity type provided on a top surface of a substrate;

a central electrode provided on a first part of the first compound semiconductor layer;

a second compound semiconductor layer of a second conductivity type provided above the top surface of the substrate covering a second part of the top surface of the first compound semiconductor layer, said second compound semiconductor layer surrounding all or nearly all of the central electrode and an exposed part of the first compound semiconductor layer lying between the central electrode and the second compound semiconductor layer;

a peripheral electrode provided on the second compound semiconductor layer, the peripheral electrode surrounding all or nearly all of the central electrode and the exposed part of the first compound semiconductor layer between the central electrode and the second compound semiconductor layer without any overlap between the peripheral electrode and the central electrode as viewed from above; and

wherein light is produced from an area between opposing portions of the central and peripheral electrodes.

2. The diode according to claim 1, wherein said electrodes have a circular shape.

3. The diode according to claim 1, wherein said electrodes have a rectangular shape.

4. The diode according to claim 1, wherein said peripheral electrode is C-shaped and nearly surrounds said central electrode.

5. The diode according to claim 1, wherein said electrodes are electrically connected to a separate wiring substrate by bonding pads.

6. The diode according to claim 5, wherein said separate wiring substrate has light-reflecting extensions surrounding all sides of said first compound semiconductor layer and said second compound semiconductor layer.

7. The device according to claim 1, wherein said first and second compound semiconductor layers include gallium and nitrogen.

8. A light-emitting semiconductor diode comprising:

a first n-type compound semiconductor layer containing at least gallium and nitrogen and provided on a top surface of an insulating substrate;

a second p-type compound semiconductor layer of a second conductivity type containing at least gallium and nitrogen and provided covering only a central portion of the first n-type compound semiconductor layer;

a central electrode provided over and contacting a central part of the second p-type compound semiconductor layer;

a peripheral electrode provided on a peripheral portion of the first n-type compound semiconductor layer, said peripheral electrode being separated from and surrounding or nearly surrounding the central second p-type compound semiconductor layer and the central electrode along with an exposed portion of the first n-type compound semiconductor layer without any overlap between the peripheral electrode and the central electrode as viewed from above; and

wherein light is provided from an area between opposing portions of the central and peripheral electrodes.

9. The diode according to claim 8, wherein said insulating substrate is transparent to light.

10. The diode according to claim 8, wherein said insulating substrate is opaque to light.

11. The diode according to claim 8, wherein said electrodes have a circular shape.

12. The diode according to claim 8, wherein said first and second electrodes have a rectangular shape.

13. The diode according to claim 8, wherein said peripheral electrode is C-shaped and nearly surrounds said central electrode.

14. The diode according to claim 8, wherein said electrodes are electrically connected to a separate wiring substrate by bonding pads.

15. The diode according to claim 14, wherein said separate wiring substrate has light-reflecting extensions surrounding all sides of said n-type compound semiconductor layer and said p-type compound semiconductor layer.

16. A laser diode comprising:

a first compound semiconductor cladding layer of a first conductivity type provided on top of a substrate;

a compound semiconductor active light emitting layer provided over only a central part of said first compound semiconductor cladding layer;

a second compound semiconductor cladding layer of a second conductivity type provided over the active layer;

a central electrode provided on a central part of said second compound semiconductor cladding layer; and

a peripheral electrode provided on a peripheral part of said first compound semiconductor cladding layer at least partly surrounding but not in contact with said centrally located active layer covered by said second compound semiconductor cladding layer and the central electrode without any overlap between the peripheral electrode and the central electrode as viewed from above; and

wherein light is produced along side edge portions of the active layer.

17. The laser diode according to claim 16, wherein said central electrode is of a rectangular shape and that part of said peripheral electrode which surrounds said central electrode on the surrounding part of the first compound semiconductor cladding layer has a corresponding shape.

18. The laser diode according to claim 16, wherein at least part of the side edge portions of the active layer and corresponding side edge portions of the covering second compound semiconductor cladding layer are covered with a film made of a material which has a band gap larger than that of the active layer and a refractive index lower than that of the active layer.

19. The laser diode according to claim 18, wherein said film is a passivation film.

20. The laser diode according to claim 16, wherein said peripheral electrode has an upper surface which is lower in elevation than a corresponding elevation of said active layer.

21. The laser diode according to claim 16, wherein said central electrode is rectangular in shape, and said peripheral electrode surrounds at least three sides of said central rectangularly shaped electrode.